Effect of stamping deformation on microstructure and properties evolution of an Al–Mg–Si–Cu alloy for automotive panels

The effect of 5 % tensile deformation, which simulates the stamping process of Al–Mg–Si–Cu automotive outer panels, on the microstructural evolution during age strengthening, has been investigated. In addition, its benefit on key mechanical properties including hardness, yield strength, ductility, and corrosion resistance has been linked to the microstructural features. It was found that the aging precipitation sequence, SSSS → clusters and G.P. zones → β″ → β′ + Q′ → Q, was not influenced by the dislocations introduced through the stamping deformation prior to aging. On the other hand, stamping deformation could promote the formation of precipitates and refine the precipitates because of the enhanced heterogeneous nucleation and the accelerated precipitation kinetics, leading to superior strength of the alloy at the early stage. Meanwhile, the larger amount of Cu incorporated into nanoprecipitates leads to better intergranular corrosion resistance of the stamped alloy compared with the unstamped one. Due to the reduction in free Si amount at grain boundaries, the formation of fine subgrain structures and the increase of dislocation accumulation, the ductility of the stamped alloy was increased.