Impact of thermal treatments on epitaxial GayIn1−y As1−x Bi x layers luminescent properties

In this work, thick Ga0.485In0.515As1−xBix epitaxial layers were grown on semi-insulating (100)-oriented InP:Fe substrates by molecular beam epitaxy. For investigation of the buffer layer influence on Ga0.485In0.515As1−xBix properties, two compositions of buffers were used: lattice matched to InP:Fe...

Ausführliche Beschreibung

Gespeichert in:
Bibliographische Detailangaben
Veröffentlicht in:Journal of materials science 2018-06, Vol.53 (11), p.8339-8346
Hauptverfasser: Stanionytė, S, Pačebutas, V, Čechavičius, B, Bičiūnas, A, Geižutis, A, Bukauskas, V, Butkutė, R, Krotkus, A
Format: Artikel
Sprache:eng
Schlagworte:
Online-Zugang:Volltext
Tags: Tag hinzufügen
Keine Tags, Fügen Sie den ersten Tag hinzu!
Beschreibung
Zusammenfassung:In this work, thick Ga0.485In0.515As1−xBix epitaxial layers were grown on semi-insulating (100)-oriented InP:Fe substrates by molecular beam epitaxy. For investigation of the buffer layer influence on Ga0.485In0.515As1−xBix properties, two compositions of buffers were used: lattice matched to InP:Fe substrate—Ga0.477In0.523As, and lattice matched to bismide layer—Ga0.434In0.566As. The buffer layer thickness varied from 100 to 650 nm. Three hundred-nm-thick bismide layers were grown at 280–300 °C substrate temperature with growth rate of 300 nm/h. Structural investigations of ω − 2θ rocking curves measured for (004) reflex revealed the incorporation of Bi up to 3.6% in quaternary compound. Bismide layer surface inspection by atomic force microscopy demonstrated roughness of about 0.65 nm. Despite the fact that structures are 100’s of nanometers thick, reciprocal space mapping measurement demonstrated that both the buffer and the bismide layers are fully strained. It has also been revealed that rapid annealing at the temperature range of 550–700 °C of Ga0.485In0.515As1−xBix layers improves photoluminescence intensity, extends carrier lifetime and enhances electron mobility.
ISSN:0022-2461
1573-4803
DOI:10.1007/s10853-018-2145-3