Structural and Thermoelectric Properties of Solid–Liquid In4Se3-In Composite
The aim of our work was to investigate thermoelectric properties of a composite of solid In 4 Se 3 and solid or liquid indium. Polycrystalline In 4 Se 3 -In composites were prepared by a direct reaction of elements, powdering of products and sintering powders by pulsed electric current sintering tec...
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Veröffentlicht in: | Journal of electronic materials 2019-09, Vol.48 (9), p.5418-5427 |
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Format: | Artikel |
Sprache: | eng |
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Zusammenfassung: | The aim of our work was to investigate thermoelectric properties of a composite of solid In
4
Se
3
and solid or liquid indium. Polycrystalline In
4
Se
3
-In composites were prepared by a direct reaction of elements, powdering of products and sintering powders by pulsed electric current sintering technique. Microstructural and structural properties of obtained composites were analyzed using SEM + EDX and XRD techniques. Electrical transport properties and thermal conductivity were measured over a temperature range of 323 K ≤
T
≤ 673 K. Results show that the electrical conductivity of composite increases about four times in comparison with that of pristine In
4
Se
3
. The thermal conductivity decreases in a systematic way with the increase of In content and reaches a value of about 0.44 W m
−1
K
−1
. As a result, the addition of indium enhances the thermoelectric figure of merit ZT from 0.8 to 1.2 at 673 K. However, we found that the melting of indium at about 430 K has no significant influence on thermoelectric properties of composites. We assume that the improvement of electrical properties is mainly due to the formation of point defects in In
4
Se
3
phase and metallic properties of the In phase. To analyze formation energies of possible defects in In
4
Se
3
structure, DFT calculations within the molecular cluster model were carried out. It was found that the In interstitial atoms are energetically more favorable than the formation of Se vacancy in In
4
Se
3
structure. |
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ISSN: | 0361-5235 1543-186X |
DOI: | 10.1007/s11664-019-07399-w |