ACTUAL INSULATION PERFORMANCE AND DESIGN THERMAL CONDUCTIVITY OF ALC PANELS

Thermal conductivity of ALC panels is described as 0.19 W/(m・K) in JIS A 5416_2016 which is used for a standard value for JIS certification. On the other hand, 0.17 W/(m・K) is generally used for the design value of ALC panels. In this paper, the design value is examined by measurements of actual ALC...

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Veröffentlicht in:AIJ Journal of Technology and Design 2018/06/20, Vol.24(57), pp.709-714
Hauptverfasser: MIZUTANI, Yoshikatsu, KONDO, Yasushi, SEIKE, Tsuyoshi, KOYAMA, Akio, FUJIMOTO, Tetsuo, MIYAUCHI, Tohru
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Sprache:jpn
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Zusammenfassung:Thermal conductivity of ALC panels is described as 0.19 W/(m・K) in JIS A 5416_2016 which is used for a standard value for JIS certification. On the other hand, 0.17 W/(m・K) is generally used for the design value of ALC panels. In this paper, the design value is examined by measurements of actual ALC under various conditions. The results show that the value is appropriate to use to designing.
ISSN:1341-9463
1881-8188
DOI:10.3130/aijt.24.709