Influence of Annealing Temperature on Electrically Active Centers in Silicon Implanted with Germanium Ions

The implantation of Czochralski-grown p -type silicon with 1-MeV germanium ions at a dose of 2 . 5 × 10 14 cm –2 does not lead to the amorphization of single-crystal silicon. Under subsequent high-temperature annealing, electrically active acceptor centers are transformed. Their concentration and sp...

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Veröffentlicht in:Semiconductors (Woodbury, N.Y.) N.Y.), 2019-02, Vol.53 (2), p.153-155
Hauptverfasser: Sobolev, N. A., Aleksandrov, O. V., Sakharov, V. I., Serenkov, I. T., Shek, E. I., Kalyadin, A. E., Parshin, E. O., Melesov, N. S.
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Sprache:eng
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Zusammenfassung:The implantation of Czochralski-grown p -type silicon with 1-MeV germanium ions at a dose of 2 . 5 × 10 14 cm –2 does not lead to the amorphization of single-crystal silicon. Under subsequent high-temperature annealing, electrically active acceptor centers are transformed. Their concentration and special distribution depend on the annealing temperature. The possible factors determining how these centers are formed are discussed.
ISSN:1063-7826
1090-6479
DOI:10.1134/S1063782619020222