A study on the resistivity and mechanical properties of modified nano-Ag coated Cu particles in electrically conductive adhesives

Electrically conductive adhesives (ECAs) are mainly used in IC packaging, LED packaging and other electronic industry to replace the traditional soldering and lead-free solders, therefore, there is a constant need to improve the electrical conductive and mechanical property of ECAs. In this study, the electrical resistivity and shear strength of the modified nano-Ag coated Cu particles in ECA was investigated and compromised, in terms of filler contents, curing temperature and curing time. The conductive mechanism of the modified nano-Ag coated Cu particles in ECA was discussed as the filler content increased. Finally, the filler content was optimized by 23.5 vol% and 170 °C 100 min curing condition was selected to obtain the compromised property (5.159 × 10 −6 Ω cm 6.121 MPa), which is better than the previous one (4.99 × 10 −6 Ω cm, 4.406 MPa) at 200 °C. The tested data, as well as the failure mode and fracture interfaces, were carried out in this study.