The evolution on the microstructure and thermal expansion behavior of Al–50Si alloy with different P contents

In the previous work, the Al–50Si alloy with fine primary Si is prepared by a low-cost technology. In addition, the morphology of primary Si and the metamorphic mechanism as well as the thermal expansibility of alloy are also investigated in this work. The mean size of primary Si can obtain the min...

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Veröffentlicht in:Journal of materials science. Materials in electronics 2019-04, Vol.30 (7), p.6786-6794
Hauptverfasser: Jiang, Tao, Li, Shiju, Yu, Chuang, Fu, Jinyu, Wei, Bowen, Luo, Liangliang, Xu, Guangming
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Sprache:eng
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Zusammenfassung:In the previous work, the Al–50Si alloy with fine primary Si is prepared by a low-cost technology. In addition, the morphology of primary Si and the metamorphic mechanism as well as the thermal expansibility of alloy are also investigated in this work. The mean size of primary Si can obtain the min value of 33.82 µm when the content of modifier is 3%. The thermal expansibility of alloy decreases with the increasing of modifier. The influence of microstructure, solid solubility as well as porosity on the thermal expansibility are also studied in this research. Moreover, several theoretical models such as ROM model, Turner model, Kerner model and Schapery model are also used to predict the coefficient of thermal expansion (CTE) of alloy.
ISSN:0957-4522
1573-482X
DOI:10.1007/s10854-019-00990-1