Optimization of dispersant-free colloidal ink droplets for inkjet patterning without the coffee-ring effect using 1-octanethiol-coated copper nano-ink with a Standard Clean-1-treated substrate

Inkjet-printed patterns and droplets were formed by the inkjet printing method on a Standard Clean-1 (SC-1)-treated substrate using anti-oxidized copper nano-ink. The hydrophobicity of the substrate increased after the SC-1 treatment. Copper nanoparticles were coated with 1-octanethiol vapors via a...

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Veröffentlicht in:Materials chemistry and physics 2019-02, Vol.223, p.779-783
Hauptverfasser: Son, Yeon-Ho, Kang, Min Kyu, Lee, Caroline Sunyong
Format: Artikel
Sprache:eng
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Zusammenfassung:Inkjet-printed patterns and droplets were formed by the inkjet printing method on a Standard Clean-1 (SC-1)-treated substrate using anti-oxidized copper nano-ink. The hydrophobicity of the substrate increased after the SC-1 treatment. Copper nanoparticles were coated with 1-octanethiol vapors via a dry coating method to produce anti-oxidized nanoparticles, which were dispersed in a solvent to form a nano-ink. Droplets of the 1-octanethiol-coated copper nano-ink at 50 wt% concentration had a uniform morphology when printed on the SC-1-treated glass substrate. The minimum printed pattern line width was 55 μm on the SC-1-treated glass and had a resistivity of 1.73 × 10−7 Ω m. This resistivity was 4.3-times lower than that of the untreated substrate. Moreover, the pattern printed using the nano-ink made with 1-octanethiol-coated copper nanoparticles showed good adhesion and provided approximately 2.1-times lower resistivity. The dispersion of the nanoparticles within the droplet was more hydrophobic and formed uniform inkjet-printed patterns that had lower resistivity compared with those made with the uncoated nanoparticle-containing ink. •The standard clean-1(SC-1) treatment increases the hydrophobicity of the substrate.•55 μm in width with a resistivity of 1.73 × 10−7 Ω m On the SC-1 treated glass.•Morphology of the inkjet pattern were improved with coating copper nanoparticles.•The pattern with coating copper 1.6 times lower resistivity than uncoated one.
ISSN:0254-0584
1879-3312
DOI:10.1016/j.matchemphys.2018.11.064