The effects of W content on solid-solution strengthening and the critical Hall-Petch grain size in Ni-W alloy
Nanocrystalline and amorphous nickel-tungsten alloy with relatively high tungsten contents of up to 34 at.% were produced by electrodeposition. The Hall-Petch relationship and breakdown was studied in this alloy, with grain sizes ranging from 25 nm to fully amorphous. In this higher tungsten content...
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| Veröffentlicht in: | Surface & coatings technology 2019-01, Vol.357, p.23-27 |
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| creator | Ong, Chun Yee Aaron Blackwood, Daniel John Li, Yi |
| description | Nanocrystalline and amorphous nickel-tungsten alloy with relatively high tungsten contents of up to 34 at.% were produced by electrodeposition. The Hall-Petch relationship and breakdown was studied in this alloy, with grain sizes ranging from 25 nm to fully amorphous. In this higher tungsten content alloy, evidence of solid-solution strengthening was found, which was previously absent in alloys with |
| doi_str_mv | 10.1016/j.surfcoat.2018.09.086 |
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•Hall-Petch relationship was observed in nanocrystalline nickel-tungsten alloy.•Critical Hall-Petch grain size was 5 nm, smaller than for pure nickel.•Solid-solution strengthening was observed, previously said to be not present.•Solid-solution strengthening appears to occur only above 13 at.% tungsten.</description><identifier>ISSN: 0257-8972</identifier><identifier>EISSN: 1879-3347</identifier><identifier>DOI: 10.1016/j.surfcoat.2018.09.086</identifier><language>eng</language><publisher>Lausanne: Elsevier B.V</publisher><subject>Alloys ; Electrodeposition ; Grain size ; Hall-Petch effect ; Nanocrystalline metal ; Nanocrystals ; Nickel ; Nickel alloys ; Nickel base alloys ; Nickel-tungsten ; Solid solutions ; Solution strengthening</subject><ispartof>Surface & coatings technology, 2019-01, Vol.357, p.23-27</ispartof><rights>2018 Elsevier B.V.</rights><rights>Copyright Elsevier BV Jan 15, 2019</rights><lds50>peer_reviewed</lds50><woscitedreferencessubscribed>false</woscitedreferencessubscribed><citedby>FETCH-LOGICAL-c340t-c03e9c78df4f605f5146f18e2510c19f690bd2b1e3b076ade5e70791caabc9123</citedby><cites>FETCH-LOGICAL-c340t-c03e9c78df4f605f5146f18e2510c19f690bd2b1e3b076ade5e70791caabc9123</cites></display><links><openurl>$$Topenurl_article</openurl><openurlfulltext>$$Topenurlfull_article</openurlfulltext><thumbnail>$$Tsyndetics_thumb_exl</thumbnail><linktohtml>$$Uhttps://www.sciencedirect.com/science/article/pii/S0257897218310594$$EHTML$$P50$$Gelsevier$$H</linktohtml><link.rule.ids>314,776,780,3537,27901,27902,65534</link.rule.ids></links><search><creatorcontrib>Ong, Chun Yee Aaron</creatorcontrib><creatorcontrib>Blackwood, Daniel John</creatorcontrib><creatorcontrib>Li, Yi</creatorcontrib><title>The effects of W content on solid-solution strengthening and the critical Hall-Petch grain size in Ni-W alloy</title><title>Surface & coatings technology</title><description>Nanocrystalline and amorphous nickel-tungsten alloy with relatively high tungsten contents of up to 34 at.% were produced by electrodeposition. The Hall-Petch relationship and breakdown was studied in this alloy, with grain sizes ranging from 25 nm to fully amorphous. In this higher tungsten content alloy, evidence of solid-solution strengthening was found, which was previously absent in alloys with <13 at.% tungsten. A Hall-Petch trend with a critical grain size of 5 nm was observed, in line with expectations.
•Hall-Petch relationship was observed in nanocrystalline nickel-tungsten alloy.•Critical Hall-Petch grain size was 5 nm, smaller than for pure nickel.•Solid-solution strengthening was observed, previously said to be not present.•Solid-solution strengthening appears to occur only above 13 at.% tungsten.</description><subject>Alloys</subject><subject>Electrodeposition</subject><subject>Grain size</subject><subject>Hall-Petch effect</subject><subject>Nanocrystalline metal</subject><subject>Nanocrystals</subject><subject>Nickel</subject><subject>Nickel alloys</subject><subject>Nickel base alloys</subject><subject>Nickel-tungsten</subject><subject>Solid solutions</subject><subject>Solution strengthening</subject><issn>0257-8972</issn><issn>1879-3347</issn><fulltext>true</fulltext><rsrctype>article</rsrctype><creationdate>2019</creationdate><recordtype>article</recordtype><recordid>eNqFkE1LAzEQhoMoWKt_QQKed53sVzY3pfgFoh4UjyHNTtqUNalJKtRfb0r17GU-mHfeYR5CzhmUDFh3uSrjJhjtVSorYH0JooS-OyAT1nNR1HXDD8kEqpYXveDVMTmJcQUAjItmQj5el0jRGNQpUm_oO9XeJXSJekejH-1Q5LhJdtemgG6RluisW1DlBpprqoNNVquR3qtxLF4w6SVdBGWz3n4jzfnJFu80D_32lBwZNUY8-81T8nZ78zq7Lx6f7x5m14-FrhtIhYYaheb9YBrTQWta1nSG9Vi1DDQTphMwH6o5w3oOvFMDtsiBC6aVmmvBqnpKLva-6-A_NxiTXPlNcPmkrPLfVQudYFnV7VU6-BgDGrkO9kOFrWQgd2jlSv6hlTu0EoTMaPPi1X4R8w9fFoOM2qLTONiQQcrB2_8sfgCp44aR</recordid><startdate>20190115</startdate><enddate>20190115</enddate><creator>Ong, Chun Yee Aaron</creator><creator>Blackwood, Daniel John</creator><creator>Li, Yi</creator><general>Elsevier B.V</general><general>Elsevier BV</general><scope>AAYXX</scope><scope>CITATION</scope><scope>7QQ</scope><scope>7SR</scope><scope>8BQ</scope><scope>8FD</scope><scope>JG9</scope></search><sort><creationdate>20190115</creationdate><title>The effects of W content on solid-solution strengthening and the critical Hall-Petch grain size in Ni-W alloy</title><author>Ong, Chun Yee Aaron ; Blackwood, Daniel John ; Li, Yi</author></sort><facets><frbrtype>5</frbrtype><frbrgroupid>cdi_FETCH-LOGICAL-c340t-c03e9c78df4f605f5146f18e2510c19f690bd2b1e3b076ade5e70791caabc9123</frbrgroupid><rsrctype>articles</rsrctype><prefilter>articles</prefilter><language>eng</language><creationdate>2019</creationdate><topic>Alloys</topic><topic>Electrodeposition</topic><topic>Grain size</topic><topic>Hall-Petch effect</topic><topic>Nanocrystalline metal</topic><topic>Nanocrystals</topic><topic>Nickel</topic><topic>Nickel alloys</topic><topic>Nickel base alloys</topic><topic>Nickel-tungsten</topic><topic>Solid solutions</topic><topic>Solution strengthening</topic><toplevel>peer_reviewed</toplevel><toplevel>online_resources</toplevel><creatorcontrib>Ong, Chun Yee Aaron</creatorcontrib><creatorcontrib>Blackwood, Daniel John</creatorcontrib><creatorcontrib>Li, Yi</creatorcontrib><collection>CrossRef</collection><collection>Ceramic Abstracts</collection><collection>Engineered Materials Abstracts</collection><collection>METADEX</collection><collection>Technology Research Database</collection><collection>Materials Research Database</collection><jtitle>Surface & coatings technology</jtitle></facets><delivery><delcategory>Remote Search Resource</delcategory><fulltext>fulltext</fulltext></delivery><addata><au>Ong, Chun Yee Aaron</au><au>Blackwood, Daniel John</au><au>Li, Yi</au><format>journal</format><genre>article</genre><ristype>JOUR</ristype><atitle>The effects of W content on solid-solution strengthening and the critical Hall-Petch grain size in Ni-W alloy</atitle><jtitle>Surface & coatings technology</jtitle><date>2019-01-15</date><risdate>2019</risdate><volume>357</volume><spage>23</spage><epage>27</epage><pages>23-27</pages><issn>0257-8972</issn><eissn>1879-3347</eissn><abstract>Nanocrystalline and amorphous nickel-tungsten alloy with relatively high tungsten contents of up to 34 at.% were produced by electrodeposition. The Hall-Petch relationship and breakdown was studied in this alloy, with grain sizes ranging from 25 nm to fully amorphous. In this higher tungsten content alloy, evidence of solid-solution strengthening was found, which was previously absent in alloys with <13 at.% tungsten. A Hall-Petch trend with a critical grain size of 5 nm was observed, in line with expectations.
•Hall-Petch relationship was observed in nanocrystalline nickel-tungsten alloy.•Critical Hall-Petch grain size was 5 nm, smaller than for pure nickel.•Solid-solution strengthening was observed, previously said to be not present.•Solid-solution strengthening appears to occur only above 13 at.% tungsten.</abstract><cop>Lausanne</cop><pub>Elsevier B.V</pub><doi>10.1016/j.surfcoat.2018.09.086</doi><tpages>5</tpages></addata></record> |
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| language | eng |
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| source | Elsevier ScienceDirect Journals Complete |
| subjects | Alloys Electrodeposition Grain size Hall-Petch effect Nanocrystalline metal Nanocrystals Nickel Nickel alloys Nickel base alloys Nickel-tungsten Solid solutions Solution strengthening |
| title | The effects of W content on solid-solution strengthening and the critical Hall-Petch grain size in Ni-W alloy |
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