The effects of W content on solid-solution strengthening and the critical Hall-Petch grain size in Ni-W alloy

The effects of W content on solid-solution strengthening and the critical Hall-Petch grain size in Ni-W alloy

Nanocrystalline and amorphous nickel-tungsten alloy with relatively high tungsten contents of up to 34 at.% were produced by electrodeposition. The Hall-Petch relationship and breakdown was studied in this alloy, with grain sizes ranging from 25 nm to fully amorphous. In this higher tungsten content...

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Veröffentlicht in:Surface & coatings technology 2019-01, Vol.357, p.23-27
Hauptverfasser: Ong, Chun Yee Aaron, Blackwood, Daniel John, Li, Yi
Format: Artikel
Sprache:eng
Schlagworte:
Alloys
Electrodeposition
Grain size
Hall-Petch effect
Nanocrystalline metal
Nanocrystals
Nickel
Nickel alloys
Nickel base alloys
Nickel-tungsten
Solid solutions
Solution strengthening
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Zusammenfassung:Nanocrystalline and amorphous nickel-tungsten alloy with relatively high tungsten contents of up to 34 at.% were produced by electrodeposition. The Hall-Petch relationship and breakdown was studied in this alloy, with grain sizes ranging from 25 nm to fully amorphous. In this higher tungsten content alloy, evidence of solid-solution strengthening was found, which was previously absent in alloys with
ISSN:0257-8972
1879-3347
DOI:10.1016/j.surfcoat.2018.09.086