Interface crack between magnetoelectroelastic and orthotropic half-spaces under anti-plane loading

•Interface crack between magnetoelectroelastic and orthotropic materials is studied.•Full-field solution in the cracked bi-materials is given.•Crack propagation can either be enhanced or retarded. In this paper, an interface crack between magnetoelectroelastic and orthotropic half-spaces under anti-plane shear and in-plane electric and magnetic loadings has been studied. By using integral transform techniques the mixed boundary value problem for interface crack was reduced to the solution of singular integral equations, which can be further reduced to solving a Riemann-Hilbert problem with closed form solution. An analytic full-field solution for stresses, electric fields, magnetic fields, electric displacement and magnetic induction in the cracked bi-materials is given, and of particular interests, the analytical expression of the stresses, electric displacements and magnetic inductions along the interface has been obtained. The crack sliding displacements (CSDs) of the interface crack are provided, and it is found that the stress distributions inside the orthotropic material are dependent on the elastic stiffness of the orthotropic material. The results of the stress intensity factors indicate that the crack propagation can either be enhanced or retarded depending on the magnitude and direction of the electric and magnetic loadings.