Effect of Single Power Two Circuits Electroslag Remelting Process on the Ingot Solidification Quality

The laboratory experiments have been carried out to investigate the effects of different power supply circuits on the solidification quality of GCr15 manufactured by the single‐power, two‐circuit electroslag remelting process. According to the previous research, the different power supply circuits are named as conventional electroslag remelting withdrawal process (ESRW), single power two circuits electroslag remelting process (ESR‐STCCM) with up power process (ESR‐STCCM‐U) and down power process (ESR‐STCCM‐D), respectively. The profile and depth of the molten pool, macroscopic and microscopic solidification structure, macrosegregation and microsegregation (macro‐/microsegregation) are analyzed. Compared with the ESRW process, ESR‐STCCM process can obtain a flatter and shallower molten pool. Besides, experimental and numerical results adequately prove ESR‐STCCM process can reduce the width of the mushy zone and the local solidification time (LST), therefore, the macro‐/microsegregation of segregation elements for ESR‐STCCM process are dramatically improved compared with ESRW process, especially for ESR‐STCCM‐D process. The remelting ingots are manufactured by ESRW and the single‐power, two‐circuit electroslag remelting process with different power supply circuits with the dimensions of Φ250 mm × 450 mm. Compared with ESRW process, ESR‐STCCM can significantly improve the solidification quality of remelting ingot, especially for ESR‐STCCM‐D process. ESR‐STCCM‐D process is suitable for remelting large‐scale ingot and high alloy ingot.