A Novel Approach for Simple, Fast and Cheap Packaging of MEMS and MMIC

The packaging of MEMS and MMIC devices has become a trending topic in the last years. This paper presents a novel approach for MEMS and MMIC packaging. The proposed packaging procedure combines simple single layer printed circuit board (PCB) techniques, Wire-Bonding and 3D printing, resulting in a simple, fast and cheap alternative. Since there is no need for Via Holes the package performance is privileged while the fabrication process is simplified. The novel approach was used in the design and fabrication of a package for a RF MEMS digital phase shifter. The simulation and measurements data are presented alongside with the related conclusions.