Wire bonding of low-k devices

Purpose - The purpose of this paper is to review recent advances in wire bonding of low-k devices.Design methodology approach - Dozens of journal and conference articles published in 2005-2008 are reviewed.Findings - The paper finds that many articles have discussed and analysed problems challenges...

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Veröffentlicht in:	Microelectronics international 2008-07, Vol.25 (3), p.19-25
1. Verfasser:	Zhong, Z.W
Format:	Artikel
Sprache:	eng
Schlagworte:	Applied sciences Cables Design of experiments Design. Technologies. Operation analysis. Testing Dielectric properties Electronics Exact sciences and technology Integrated circuits Interfacial bonding Performance evaluation Semiconductor electronics. Microelectronics. Optoelectronics. Solid state devices Studies Technology Wire
Online-Zugang:	Volltext
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