Wire bonding of low-k devices

Purpose - The purpose of this paper is to review recent advances in wire bonding of low-k devices.Design methodology approach - Dozens of journal and conference articles published in 2005-2008 are reviewed.Findings - The paper finds that many articles have discussed and analysed problems challenges such as bond pad metal peeling lift, non-sticking on pad, decreased bonding strength and lower wire-bond assembly yield. The paper discusses the articles' solutions to the problems and recent findings developments in wire bonding of low-k devices.Research limitations implications - Because of the page limitation, only brief discussions are given in this paper. Further reading is needed for more details.Originality value - The paper attempts to provide an introduction to recent developments and the trends in wire bonding of low-k devices. With the references provided, readers may explore more deeply by reading the original articles.