Wire bonding of low-k devices
Purpose - The purpose of this paper is to review recent advances in wire bonding of low-k devices.Design methodology approach - Dozens of journal and conference articles published in 2005-2008 are reviewed.Findings - The paper finds that many articles have discussed and analysed problems challenges...
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| Veröffentlicht in: | Microelectronics international 2008-07, Vol.25 (3), p.19-25 |
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| container_title | Microelectronics international |
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| creator | Zhong, Z.W |
| description | Purpose - The purpose of this paper is to review recent advances in wire bonding of low-k devices.Design methodology approach - Dozens of journal and conference articles published in 2005-2008 are reviewed.Findings - The paper finds that many articles have discussed and analysed problems challenges such as bond pad metal peeling lift, non-sticking on pad, decreased bonding strength and lower wire-bond assembly yield. The paper discusses the articles' solutions to the problems and recent findings developments in wire bonding of low-k devices.Research limitations implications - Because of the page limitation, only brief discussions are given in this paper. Further reading is needed for more details.Originality value - The paper attempts to provide an introduction to recent developments and the trends in wire bonding of low-k devices. With the references provided, readers may explore more deeply by reading the original articles. |
| doi_str_mv | 10.1108/13565360810889584 |
| format | Article |
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| identifier | ISSN: 1356-5362 |
| ispartof | Microelectronics international, 2008-07, Vol.25 (3), p.19-25 |
| issn | 1356-5362 1758-812X |
| language | eng |
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| source | Emerald Journals |
| subjects | Applied sciences Cables Design of experiments Design. Technologies. Operation analysis. Testing Dielectric properties Electronics Exact sciences and technology Integrated circuits Interfacial bonding Performance evaluation Semiconductor electronics. Microelectronics. Optoelectronics. Solid state devices Studies Technology Wire |
| title | Wire bonding of low-k devices |
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