Microstructure investigation of Sn-0.5Cu-3.5Ag and Sn-3.5Ag-0.5Cu-0.5B lead-free solders
Identifies the intermetallics formed in Sn-0.5Cu-3.5Ag and Sn-3.5Ag-0.5Cu-0.5B (wt%) lead-free solders, and the influence of boron on these precipitates. SEM, TEM and SIMS were employed to reveal the difference of microstructure in both solder alloys. It was found that the intermetallics formed were...
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| Veröffentlicht in: | Soldering & surface mount technology 2001, Vol.13 (3), p.16-20 |
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| container_title | Soldering & surface mount technology |
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| creator | Ye, L Lai, Z.H Liu, J Thölén, A |
| description | Identifies the intermetallics formed in Sn-0.5Cu-3.5Ag and Sn-3.5Ag-0.5Cu-0.5B (wt%) lead-free solders, and the influence of boron on these precipitates. SEM, TEM and SIMS were employed to reveal the difference of microstructure in both solder alloys. It was found that the intermetallics formed were Ag3Sn and Cu6Sn5. Both solders were found to have a dispersion structure of Ag3Sn particles with network-shaped subgrains. The microstructure of Ag3Sn was also found to become finer and more uniform in Sn-3.5Ag-0.5Cu-0.5B solder, due to the addition of boron, while there was little effect from the boron on the Cu6Sn5 phase. |
| doi_str_mv | 10.1108/EUM0000000006025 |
| format | Article |
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SEM, TEM and SIMS were employed to reveal the difference of microstructure in both solder alloys. It was found that the intermetallics formed were Ag3Sn and Cu6Sn5. Both solders were found to have a dispersion structure of Ag3Sn particles with network-shaped subgrains. The microstructure of Ag3Sn was also found to become finer and more uniform in Sn-3.5Ag-0.5Cu-0.5B solder, due to the addition of boron, while there was little effect from the boron on the Cu6Sn5 phase.</description><identifier>ISSN: 0954-0911</identifier><identifier>EISSN: 1758-6836</identifier><identifier>DOI: 10.1108/EUM0000000006025</identifier><identifier>CODEN: SSMOEO</identifier><language>eng</language><publisher>Bradford: MCB UP Ltd</publisher><subject>Alloys ; Applied sciences ; Boron ; Copper ; Electronic equipment and fabrication. Passive components, printed wiring boards, connectics ; Electronics ; Exact sciences and technology ; Experiments ; Intermetallic compounds ; Lead ; Lead free solders ; Materials science ; Metal fatigue ; Metallurgy ; Microstructure ; Physics ; Process engineering ; Scientific imaging ; Shear strength ; Surface mount technology ; Temperature ; Toxicity</subject><ispartof>Soldering & surface mount technology, 2001, Vol.13 (3), p.16-20</ispartof><rights>MCB UP Limited</rights><rights>2002 INIST-CNRS</rights><rights>Copyright MCB UP Limited (MCB) 2001</rights><lds50>peer_reviewed</lds50><woscitedreferencessubscribed>false</woscitedreferencessubscribed><citedby>FETCH-LOGICAL-c378t-a629fc79bfd415593b0004b4c33789b9b07185766a3579cd820198b6c2266c353</citedby><cites>FETCH-LOGICAL-c378t-a629fc79bfd415593b0004b4c33789b9b07185766a3579cd820198b6c2266c353</cites></display><links><openurl>$$Topenurl_article</openurl><openurlfulltext>$$Topenurlfull_article</openurlfulltext><thumbnail>$$Tsyndetics_thumb_exl</thumbnail><linktopdf>$$Uhttps://www.emerald.com/insight/content/doi/10.1108/EUM0000000006025/full/pdf$$EPDF$$P50$$Gemerald$$H</linktopdf><linktohtml>$$Uhttps://www.emerald.com/insight/content/doi/10.1108/EUM0000000006025/full/html$$EHTML$$P50$$Gemerald$$H</linktohtml><link.rule.ids>314,780,784,967,4024,11635,27923,27924,27925,52686,52689</link.rule.ids><backlink>$$Uhttp://pascal-francis.inist.fr/vibad/index.php?action=getRecordDetail&idt=14067336$$DView record in Pascal Francis$$Hfree_for_read</backlink></links><search><creatorcontrib>Ye, L</creatorcontrib><creatorcontrib>Lai, Z.H</creatorcontrib><creatorcontrib>Liu, J</creatorcontrib><creatorcontrib>Thölén, A</creatorcontrib><title>Microstructure investigation of Sn-0.5Cu-3.5Ag and Sn-3.5Ag-0.5Cu-0.5B lead-free solders</title><title>Soldering & surface mount technology</title><description>Identifies the intermetallics formed in Sn-0.5Cu-3.5Ag and Sn-3.5Ag-0.5Cu-0.5B (wt%) lead-free solders, and the influence of boron on these precipitates. SEM, TEM and SIMS were employed to reveal the difference of microstructure in both solder alloys. It was found that the intermetallics formed were Ag3Sn and Cu6Sn5. Both solders were found to have a dispersion structure of Ag3Sn particles with network-shaped subgrains. The microstructure of Ag3Sn was also found to become finer and more uniform in Sn-3.5Ag-0.5Cu-0.5B solder, due to the addition of boron, while there was little effect from the boron on the Cu6Sn5 phase.</description><subject>Alloys</subject><subject>Applied sciences</subject><subject>Boron</subject><subject>Copper</subject><subject>Electronic equipment and fabrication. Passive components, printed wiring boards, connectics</subject><subject>Electronics</subject><subject>Exact sciences and technology</subject><subject>Experiments</subject><subject>Intermetallic compounds</subject><subject>Lead</subject><subject>Lead free solders</subject><subject>Materials science</subject><subject>Metal fatigue</subject><subject>Metallurgy</subject><subject>Microstructure</subject><subject>Physics</subject><subject>Process engineering</subject><subject>Scientific imaging</subject><subject>Shear strength</subject><subject>Surface mount technology</subject><subject>Temperature</subject><subject>Toxicity</subject><issn>0954-0911</issn><issn>1758-6836</issn><fulltext>true</fulltext><rsrctype>article</rsrctype><creationdate>2001</creationdate><recordtype>article</recordtype><sourceid>AFKRA</sourceid><sourceid>AZQEC</sourceid><sourceid>BENPR</sourceid><sourceid>CCPQU</sourceid><sourceid>DWQXO</sourceid><sourceid>GNUQQ</sourceid><recordid>eNqFkc1LwzAYh4MoOKd3j0VQT9mSvM3XUcf8gA0POvBW0jQdHV07k1bwv7d1E2EHl0NC8j7vw0t-CF1SMqKUqPF0MSe_SxDGj9CASq6wUCCO0YBoHmOiKT1FZyGsOigWGgbofV5YX4fGt7ZpvYuK6tOFpliapqirqM6j1wqTEZ-0GEb8bhmZKuuffi67QrffR6UzGc69c1Goy8z5cI5OclMGd7E7h2jxMH2bPOHZy-Pz5G6GLUjVYCOYzq3UaZ7FlHMNaT9aGlvoyjrVKZFUcSmEAS61zRQjVKtUWMaEsMBhiG633o2vP9pu9mRdBOvK0lSubkMiY2BKs7gnb_4lgRPCJIeDIFPAqZaHjUxIxSEWHXi1B67q1lfdvySMCsaI4D1EtlAfSPAuTza-WBv_lVCS9Bkn-xl3Ldc7rwnWlLk3lS3CX19MhATo1eMt59bOmzI7bP4GppWteQ</recordid><startdate>2001</startdate><enddate>2001</enddate><creator>Ye, L</creator><creator>Lai, Z.H</creator><creator>Liu, J</creator><creator>Thölén, A</creator><general>MCB UP Ltd</general><general>Emerald</general><general>Emerald Group Publishing Limited</general><scope>IQODW</scope><scope>AAYXX</scope><scope>CITATION</scope><scope>7RQ</scope><scope>7SP</scope><scope>7TB</scope><scope>7WY</scope><scope>7XB</scope><scope>8BQ</scope><scope>8FD</scope><scope>8FE</scope><scope>8FG</scope><scope>ABJCF</scope><scope>AFKRA</scope><scope>AZQEC</scope><scope>BENPR</scope><scope>BEZIV</scope><scope>BGLVJ</scope><scope>CCPQU</scope><scope>D1I</scope><scope>DWQXO</scope><scope>FR3</scope><scope>GNUQQ</scope><scope>HCIFZ</scope><scope>JG9</scope><scope>K6~</scope><scope>KB.</scope><scope>KR7</scope><scope>L.-</scope><scope>L7M</scope><scope>M0F</scope><scope>M2P</scope><scope>PDBOC</scope><scope>PQBIZ</scope><scope>PQEST</scope><scope>PQQKQ</scope><scope>PQUKI</scope><scope>Q9U</scope></search><sort><creationdate>2001</creationdate><title>Microstructure investigation of Sn-0.5Cu-3.5Ag and Sn-3.5Ag-0.5Cu-0.5B lead-free solders</title><author>Ye, L ; Lai, Z.H ; Liu, J ; Thölén, A</author></sort><facets><frbrtype>5</frbrtype><frbrgroupid>cdi_FETCH-LOGICAL-c378t-a629fc79bfd415593b0004b4c33789b9b07185766a3579cd820198b6c2266c353</frbrgroupid><rsrctype>articles</rsrctype><prefilter>articles</prefilter><language>eng</language><creationdate>2001</creationdate><topic>Alloys</topic><topic>Applied sciences</topic><topic>Boron</topic><topic>Copper</topic><topic>Electronic equipment and fabrication. Passive components, printed wiring boards, connectics</topic><topic>Electronics</topic><topic>Exact sciences and technology</topic><topic>Experiments</topic><topic>Intermetallic compounds</topic><topic>Lead</topic><topic>Lead free solders</topic><topic>Materials science</topic><topic>Metal fatigue</topic><topic>Metallurgy</topic><topic>Microstructure</topic><topic>Physics</topic><topic>Process engineering</topic><topic>Scientific imaging</topic><topic>Shear strength</topic><topic>Surface mount technology</topic><topic>Temperature</topic><topic>Toxicity</topic><toplevel>peer_reviewed</toplevel><toplevel>online_resources</toplevel><creatorcontrib>Ye, L</creatorcontrib><creatorcontrib>Lai, Z.H</creatorcontrib><creatorcontrib>Liu, J</creatorcontrib><creatorcontrib>Thölén, A</creatorcontrib><collection>Pascal-Francis</collection><collection>CrossRef</collection><collection>Career & Technical Education Database</collection><collection>Electronics & Communications Abstracts</collection><collection>Mechanical & Transportation Engineering Abstracts</collection><collection>Access via ABI/INFORM (ProQuest)</collection><collection>ProQuest Central (purchase pre-March 2016)</collection><collection>METADEX</collection><collection>Technology Research Database</collection><collection>ProQuest SciTech Collection</collection><collection>ProQuest Technology Collection</collection><collection>Materials Science & Engineering Collection</collection><collection>ProQuest Central UK/Ireland</collection><collection>ProQuest Central Essentials</collection><collection>ProQuest Central</collection><collection>Business Premium Collection</collection><collection>Technology Collection</collection><collection>ProQuest One Community College</collection><collection>ProQuest Materials Science Collection</collection><collection>ProQuest Central Korea</collection><collection>Engineering Research Database</collection><collection>ProQuest Central Student</collection><collection>SciTech Premium Collection</collection><collection>Materials Research Database</collection><collection>ProQuest Business Collection</collection><collection>Materials Science Database</collection><collection>Civil Engineering Abstracts</collection><collection>ABI/INFORM Professional Advanced</collection><collection>Advanced Technologies Database with Aerospace</collection><collection>ABI/INFORM Trade & Industry</collection><collection>Science Database</collection><collection>Materials Science Collection</collection><collection>ProQuest One Business</collection><collection>ProQuest One Academic Eastern Edition (DO NOT USE)</collection><collection>ProQuest One Academic</collection><collection>ProQuest One Academic UKI Edition</collection><collection>ProQuest Central Basic</collection><jtitle>Soldering & surface mount technology</jtitle></facets><delivery><delcategory>Remote Search Resource</delcategory><fulltext>fulltext</fulltext></delivery><addata><au>Ye, L</au><au>Lai, Z.H</au><au>Liu, J</au><au>Thölén, A</au><format>journal</format><genre>article</genre><ristype>JOUR</ristype><atitle>Microstructure investigation of Sn-0.5Cu-3.5Ag and Sn-3.5Ag-0.5Cu-0.5B lead-free solders</atitle><jtitle>Soldering & surface mount technology</jtitle><date>2001</date><risdate>2001</risdate><volume>13</volume><issue>3</issue><spage>16</spage><epage>20</epage><pages>16-20</pages><issn>0954-0911</issn><eissn>1758-6836</eissn><coden>SSMOEO</coden><abstract>Identifies the intermetallics formed in Sn-0.5Cu-3.5Ag and Sn-3.5Ag-0.5Cu-0.5B (wt%) lead-free solders, and the influence of boron on these precipitates. SEM, TEM and SIMS were employed to reveal the difference of microstructure in both solder alloys. It was found that the intermetallics formed were Ag3Sn and Cu6Sn5. Both solders were found to have a dispersion structure of Ag3Sn particles with network-shaped subgrains. The microstructure of Ag3Sn was also found to become finer and more uniform in Sn-3.5Ag-0.5Cu-0.5B solder, due to the addition of boron, while there was little effect from the boron on the Cu6Sn5 phase.</abstract><cop>Bradford</cop><pub>MCB UP Ltd</pub><doi>10.1108/EUM0000000006025</doi><tpages>5</tpages></addata></record> |
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| source | Emerald A-Z Current Journals |
| subjects | Alloys Applied sciences Boron Copper Electronic equipment and fabrication. Passive components, printed wiring boards, connectics Electronics Exact sciences and technology Experiments Intermetallic compounds Lead Lead free solders Materials science Metal fatigue Metallurgy Microstructure Physics Process engineering Scientific imaging Shear strength Surface mount technology Temperature Toxicity |
| title | Microstructure investigation of Sn-0.5Cu-3.5Ag and Sn-3.5Ag-0.5Cu-0.5B lead-free solders |
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