Microstructure investigation of Sn-0.5Cu-3.5Ag and Sn-3.5Ag-0.5Cu-0.5B lead-free solders

Identifies the intermetallics formed in Sn-0.5Cu-3.5Ag and Sn-3.5Ag-0.5Cu-0.5B (wt%) lead-free solders, and the influence of boron on these precipitates. SEM, TEM and SIMS were employed to reveal the difference of microstructure in both solder alloys. It was found that the intermetallics formed were...

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Veröffentlicht in:	Soldering & surface mount technology 2001, Vol.13 (3), p.16-20
Hauptverfasser:	Ye, L, Lai, Z.H, Liu, J, Thölén, A
Format:	Artikel
Sprache:	eng
Schlagworte:	Alloys Applied sciences Boron Copper Electronic equipment and fabrication. Passive components, printed wiring boards, connectics Electronics Exact sciences and technology Experiments Intermetallic compounds Lead Lead free solders Materials science Metal fatigue Metallurgy Microstructure Physics Process engineering Scientific imaging Shear strength Surface mount technology Temperature Toxicity
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Zusammenfassung:	Identifies the intermetallics formed in Sn-0.5Cu-3.5Ag and Sn-3.5Ag-0.5Cu-0.5B (wt%) lead-free solders, and the influence of boron on these precipitates. SEM, TEM and SIMS were employed to reveal the difference of microstructure in both solder alloys. It was found that the intermetallics formed were Ag3Sn and Cu6Sn5. Both solders were found to have a dispersion structure of Ag3Sn particles with network-shaped subgrains. The microstructure of Ag3Sn was also found to become finer and more uniform in Sn-3.5Ag-0.5Cu-0.5B solder, due to the addition of boron, while there was little effect from the boron on the Cu6Sn5 phase.
ISSN:	0954-0911 1758-6836
DOI:	10.1108/EUM0000000006025