Effect of Laser Exposure on the Process of Silicon Nanoparticle Fabrication

Silicon nanoparticles are obtained by nanosecond laser ablation of a single-crystal wafer under a deionized water layer. Nanoparticle generation mechanisms are studied depending on the incident energy density of laser radiation (7–12 J/cm 2 ) and scanning speed (10–750 mm/s). At a scanning speed of...

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Veröffentlicht in:Bulletin of the Lebedev Physics Institute 2018-11, Vol.45 (11), p.353-355
Hauptverfasser: Saraeva, I. N., Ivanova, A. K., Kudryashov, S. I., Nastulyavichus, A. A.
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Sprache:eng
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Zusammenfassung:Silicon nanoparticles are obtained by nanosecond laser ablation of a single-crystal wafer under a deionized water layer. Nanoparticle generation mechanisms are studied depending on the incident energy density of laser radiation (7–12 J/cm 2 ) and scanning speed (10–750 mm/s). At a scanning speed of 150–200 mm/s, a maximum of the extinction coefficient of obtained colloidal solutions of nanoparticles is observed, which can be caused by an increase in their mass yield.
ISSN:1068-3356
1934-838X
DOI:10.3103/S1068335618110076