P‐13.2: AMOLED Encapsulation Technology and Prospect

The flexible organic light emitting diodes (OLEDs) has attracted a lot of attention because of its very wide and promising application prospect. The flexible encapsulation is a most problem for mass production of flexible OLEDs since their sensitivity to water and oxygen. Traditional flexible encapsulation using plasma enhanced chemical vapor deposition (PECVD) film as the inorganic layer. However owing to the complicated pattern of sub‐layer and particles, the poor step coverage of PECVD film results in bad encapsulation properties. Therefore the plasma enhanced atomic layer deposition (PEALD) is studied on account of its better step coverage and lower growth temperature. Firstly, the PECVD SiNx process has been researched to achieve the low water vapor transmission rate (WVTR) (WVTR