Failure mechanism of Ag-4Pd alloy wire bonded on Al-Si metallization under high temperature storage and thermal cycle tests in corrosive environments

This study investigated the failure mechanism of Ag-4Pd wire bonded on Al metallization under chlorine corrosive environments after high temperature storage tests (HTST) and thermal cycle tests (TCT). Results show that as-bonded samples encountered the fastest failure, caused by corrosion of Al meta...

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Veröffentlicht in:	Materials chemistry and physics 2018-10, Vol.218, p.147-153
Hauptverfasser:	Wang, Jui-Nung, Tsau, Yan-Wen, Ouyang, Fan-Yi
Format:	Artikel
Sprache:	eng
Schlagworte:	Alloys Aluminum base alloys Bonding Chlorine Corrosion Corrosion environments Corrosion rate Electronic packaging Failure analysis Failure mechanisms Galvanic corrosion Intermetallic compounds Intermetallics Metallizing Packaging Silicon Silver Silver alloy Thin film Thin films Wire
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