Effect of strain, thickness, and local surface environment on electron transport properties of oxygen-terminated copper thin films

Electron transport is studied in surface oxidized single-crystal copper thin films with a thickness of up to 5.6 nm by applying density functional theory and density functional tight binding methods to determine electron transport properties within the ballistic regime. The variation of the electron transmission as a function of film thickness as well as the different contributions to the overall electron transmission as a function of depth into the the films is examined. Transmission at the oxidized copper film surfaces is found to be universally low. Films with thickness greater than 2.7 nm exhibit a similar behavior in local transmission per unit area with depth from the film surface; transmission per unit area initially increases rapidly and then plateaus at a depth of approximately 0.35–0.5 nm away from the surface, dependent on surface facet. Unstrained films tend to exhibit a higher transmission per unit area than corresponding films under tensile strain.