Preparation of graphene nanoplatelets reinforcing copper matrix composites by electrochemical deposition

An effective preparing approach of graphene-strengthening copper-based composites by a easy electrochemical deposition and atmosphere sintering is presented. The graphene-nanoplatelets/copper (GNP/Cu) powder shows homogenous dispersion of graphene in the matrix when the addition of graphene oxide (GO) is 25.0 mg/ml in the electrochemical deposited solution. The formation of the Ni decorating graphene nanoplatelets (Ni-GNP) and the oxygen-mediated CuOC bond are promoted by electrochemical deposition. The crystal orientation relationship of (1¯11¯)Cu//(101¯0)Graphene and (222)Ni//(101¯0)Graphene is observed, and the lattice misfit ɛ* of Cu and graphene is 2.1%. The bond strength between copper and graphene is increased by Ni-GNPs, CuOC and the coherent crystal orientation relationship. Taking advantage of the GNP/Cu powders prepared by electrochemical deposition, the GNP/Cu composites with the hardness of 111.2 HV and the conductivity of 89.2% IACS are prepared. •An preparing approach of GNP/Cu powders by electrochemical deposition is presented.•The linkage between Cu and graphene is reinforced by the formation of CuOC bond.•The crystal orientation relationship of (1¯11¯)Cu//(101¯0)Graphene and (222)Ni//(101¯0)Graphene is observed.•The lattice misfit ɛ* of Cu and graphene is calculated to 2.1%.•The hardness and the conductivity of composites could reach 111.2 HV and 89.2% IACS.