Investigation of Defectivity Coming from the Back Side of Wafers during AlCu Polymer Removal Processes Performed in a Batch Spray Tool

Investigation of Defectivity Coming from the Back Side of Wafers during AlCu Polymer Removal Processes Performed in a Batch Spray Tool

The defectivity of a batch process for polymer removal in AlCu BEOL technology has been investigated, reasearching the defectivity source and studying the composition of the defects. Different solutions for the minimization of this defectivity have been found, working on the positioning of the wafer...

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Veröffentlicht in:Solid state phenomena 2018-08, Vol.282, p.220-225
Hauptverfasser: Brazzelli, Silvia, Gomarasca, Roberta, Venegoni, Ivan, Pipia, Francesco, Alessandri, Mauro
Format: Artikel
Sprache:eng
Schlagworte:
Batch processing
Polymers
Wafers
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Zusammenfassung:The defectivity of a batch process for polymer removal in AlCu BEOL technology has been investigated, reasearching the defectivity source and studying the composition of the defects. Different solutions for the minimization of this defectivity have been found, working on the positioning of the wafers or additional cleanings. The complete eradication of the defectivity has also been demonstrated performing the process on a single wafer tool.
ISSN:1012-0394
1662-9779
1662-9779
DOI:10.4028/www.scientific.net/SSP.282.220