Publisher Correction to: Development of SnAgCu solders with Bi and In additions and microstructural characterization of joint interface

Publisher Correction to: Development of SnAgCu solders with Bi and In additions and microstructural characterization of joint interface

In the original version of this article, the data displayed online in the “About this article” section for “Cite this article as:...,” the first and second name of the second author are incorrect.

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Veröffentlicht in:Welding in the world 2018, Vol.62 (5), p.1119-1119
Hauptverfasser: Beáta, Šimeková, Erika, Hodúlová, Ingrid, Kovaříková
Format: Artikel
Sprache:eng
Schlagworte:
Chemistry and Materials Science
Materials Science
Metallic Materials
Publisher Correction
Solid Mechanics
Theoretical and Applied Mechanics
Online-Zugang:Volltext
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Zusammenfassung:In the original version of this article, the data displayed online in the “About this article” section for “Cite this article as:...,” the first and second name of the second author are incorrect.
ISSN:0043-2288
1878-6669
DOI:10.1007/s40194-018-0623-5