On the Nature of the Interface between Ag^sub 3^Sn Intermetallics and Sn in Sn-3.5Ag Solder Alloys
We report on the nature of the orientation of Ag^sub 3^Sn and the Ag^sub 3^Sn/Sn interface in Sn-3.5Ag solder. Orientation imaging microscopy (OIM) and transmission electron microscopy (TEM) were used to characterize the orientation and nature of the interface, respectively. OIM and TEM showed that...
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Veröffentlicht in: | Journal of electronic materials 2007-12, Vol.36 (12), p.1615 |
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description | We report on the nature of the orientation of Ag^sub 3^Sn and the Ag^sub 3^Sn/Sn interface in Sn-3.5Ag solder. Orientation imaging microscopy (OIM) and transmission electron microscopy (TEM) were used to characterize the orientation and nature of the interface, respectively. OIM and TEM showed that Sn-3.5Ag containing spherical Ag^sub 3^Sn particles does not have a preferred orientation with respect to the Sn matrix. However, needle-like Ag^sub 3^Sn formed during slower cooling appeared to have a preferred orientation within individual Sn colonies. The interface between Sn and Ag^sub 3^Sn appeared to be incoherent, as confirmed by high-resolution TEM analysis. [PUBLICATION ABSTRACT] |
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Orientation imaging microscopy (OIM) and transmission electron microscopy (TEM) were used to characterize the orientation and nature of the interface, respectively. OIM and TEM showed that Sn-3.5Ag containing spherical Ag^sub 3^Sn particles does not have a preferred orientation with respect to the Sn matrix. However, needle-like Ag^sub 3^Sn formed during slower cooling appeared to have a preferred orientation within individual Sn colonies. The interface between Sn and Ag^sub 3^Sn appeared to be incoherent, as confirmed by high-resolution TEM analysis. 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subjects | Alloys Intermetallic compounds Lead free solders Soldering Transmission electron microscopy |
title | On the Nature of the Interface between Ag^sub 3^Sn Intermetallics and Sn in Sn-3.5Ag Solder Alloys |
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