On the Nature of the Interface between Ag^sub 3^Sn Intermetallics and Sn in Sn-3.5Ag Solder Alloys

We report on the nature of the orientation of Ag^sub 3^Sn and the Ag^sub 3^Sn/Sn interface in Sn-3.5Ag solder. Orientation imaging microscopy (OIM) and transmission electron microscopy (TEM) were used to characterize the orientation and nature of the interface, respectively. OIM and TEM showed that...

Ausführliche Beschreibung

Gespeichert in:
Bibliographische Detailangaben
Veröffentlicht in:Journal of electronic materials 2007-12, Vol.36 (12), p.1615
Hauptverfasser: Sidhu, Rajen S, Madge, Shantanu V, Deng, Xin, Chawla, Nikhilesh
Format: Artikel
Sprache:eng
Schlagworte:
Online-Zugang:Volltext
Tags: Tag hinzufügen
Keine Tags, Fügen Sie den ersten Tag hinzu!
container_end_page
container_issue 12
container_start_page 1615
container_title Journal of electronic materials
container_volume 36
creator Sidhu, Rajen S
Madge, Shantanu V
Deng, Xin
Chawla, Nikhilesh
description We report on the nature of the orientation of Ag^sub 3^Sn and the Ag^sub 3^Sn/Sn interface in Sn-3.5Ag solder. Orientation imaging microscopy (OIM) and transmission electron microscopy (TEM) were used to characterize the orientation and nature of the interface, respectively. OIM and TEM showed that Sn-3.5Ag containing spherical Ag^sub 3^Sn particles does not have a preferred orientation with respect to the Sn matrix. However, needle-like Ag^sub 3^Sn formed during slower cooling appeared to have a preferred orientation within individual Sn colonies. The interface between Sn and Ag^sub 3^Sn appeared to be incoherent, as confirmed by high-resolution TEM analysis. [PUBLICATION ABSTRACT]
format Article
fullrecord <record><control><sourceid>proquest</sourceid><recordid>TN_cdi_proquest_journals_204921568</recordid><sourceformat>XML</sourceformat><sourcesystem>PC</sourcesystem><sourcerecordid>1397299971</sourcerecordid><originalsourceid>FETCH-proquest_journals_2049215683</originalsourceid><addsrcrecordid>eNqNissKwjAURIMoWB__cHFfaZqm1GURRTe60IWrlrTe-iAmmgfi31vUD3Azw5wzHRJQnrCQZumhS4KIpTTkMeN9MrD2GkWU04wGpNoqcGeEjXDeIOjms9bKoWlEjVCheyIqyE-F9RWwYqe-9oZOSHmpLQh1hJZeVJshm_L8BDstj2ggl1K_7Ij0GiEtjn89JJPlYj9fhXejHx6tK6_aG9WqMo6SWUx5mrG_Tm_6TERA</addsrcrecordid><sourcetype>Aggregation Database</sourcetype><iscdi>true</iscdi><recordtype>article</recordtype><pqid>204921568</pqid></control><display><type>article</type><title>On the Nature of the Interface between Ag^sub 3^Sn Intermetallics and Sn in Sn-3.5Ag Solder Alloys</title><source>SpringerNature Journals</source><creator>Sidhu, Rajen S ; Madge, Shantanu V ; Deng, Xin ; Chawla, Nikhilesh</creator><creatorcontrib>Sidhu, Rajen S ; Madge, Shantanu V ; Deng, Xin ; Chawla, Nikhilesh</creatorcontrib><description>We report on the nature of the orientation of Ag^sub 3^Sn and the Ag^sub 3^Sn/Sn interface in Sn-3.5Ag solder. Orientation imaging microscopy (OIM) and transmission electron microscopy (TEM) were used to characterize the orientation and nature of the interface, respectively. OIM and TEM showed that Sn-3.5Ag containing spherical Ag^sub 3^Sn particles does not have a preferred orientation with respect to the Sn matrix. However, needle-like Ag^sub 3^Sn formed during slower cooling appeared to have a preferred orientation within individual Sn colonies. The interface between Sn and Ag^sub 3^Sn appeared to be incoherent, as confirmed by high-resolution TEM analysis. [PUBLICATION ABSTRACT]</description><identifier>ISSN: 0361-5235</identifier><identifier>EISSN: 1543-186X</identifier><identifier>CODEN: JECMA5</identifier><language>eng</language><publisher>Warrendale: Springer Nature B.V</publisher><subject>Alloys ; Intermetallic compounds ; Lead free solders ; Soldering ; Transmission electron microscopy</subject><ispartof>Journal of electronic materials, 2007-12, Vol.36 (12), p.1615</ispartof><rights>Copyright Minerals, Metals &amp; Materials Society Dec 2007</rights><lds50>peer_reviewed</lds50><woscitedreferencessubscribed>false</woscitedreferencessubscribed></display><links><openurl>$$Topenurl_article</openurl><openurlfulltext>$$Topenurlfull_article</openurlfulltext><thumbnail>$$Tsyndetics_thumb_exl</thumbnail><link.rule.ids>315,781,785</link.rule.ids></links><search><creatorcontrib>Sidhu, Rajen S</creatorcontrib><creatorcontrib>Madge, Shantanu V</creatorcontrib><creatorcontrib>Deng, Xin</creatorcontrib><creatorcontrib>Chawla, Nikhilesh</creatorcontrib><title>On the Nature of the Interface between Ag^sub 3^Sn Intermetallics and Sn in Sn-3.5Ag Solder Alloys</title><title>Journal of electronic materials</title><description>We report on the nature of the orientation of Ag^sub 3^Sn and the Ag^sub 3^Sn/Sn interface in Sn-3.5Ag solder. Orientation imaging microscopy (OIM) and transmission electron microscopy (TEM) were used to characterize the orientation and nature of the interface, respectively. OIM and TEM showed that Sn-3.5Ag containing spherical Ag^sub 3^Sn particles does not have a preferred orientation with respect to the Sn matrix. However, needle-like Ag^sub 3^Sn formed during slower cooling appeared to have a preferred orientation within individual Sn colonies. The interface between Sn and Ag^sub 3^Sn appeared to be incoherent, as confirmed by high-resolution TEM analysis. [PUBLICATION ABSTRACT]</description><subject>Alloys</subject><subject>Intermetallic compounds</subject><subject>Lead free solders</subject><subject>Soldering</subject><subject>Transmission electron microscopy</subject><issn>0361-5235</issn><issn>1543-186X</issn><fulltext>true</fulltext><rsrctype>article</rsrctype><creationdate>2007</creationdate><recordtype>article</recordtype><sourceid>8G5</sourceid><sourceid>ABUWG</sourceid><sourceid>AFKRA</sourceid><sourceid>AZQEC</sourceid><sourceid>BENPR</sourceid><sourceid>CCPQU</sourceid><sourceid>DWQXO</sourceid><sourceid>GNUQQ</sourceid><sourceid>GUQSH</sourceid><sourceid>M2O</sourceid><recordid>eNqNissKwjAURIMoWB__cHFfaZqm1GURRTe60IWrlrTe-iAmmgfi31vUD3Azw5wzHRJQnrCQZumhS4KIpTTkMeN9MrD2GkWU04wGpNoqcGeEjXDeIOjms9bKoWlEjVCheyIqyE-F9RWwYqe-9oZOSHmpLQh1hJZeVJshm_L8BDstj2ggl1K_7Ij0GiEtjn89JJPlYj9fhXejHx6tK6_aG9WqMo6SWUx5mrG_Tm_6TERA</recordid><startdate>20071201</startdate><enddate>20071201</enddate><creator>Sidhu, Rajen S</creator><creator>Madge, Shantanu V</creator><creator>Deng, Xin</creator><creator>Chawla, Nikhilesh</creator><general>Springer Nature B.V</general><scope>3V.</scope><scope>7XB</scope><scope>88I</scope><scope>8AF</scope><scope>8AO</scope><scope>8FE</scope><scope>8FG</scope><scope>8FK</scope><scope>8G5</scope><scope>ABJCF</scope><scope>ABUWG</scope><scope>AFKRA</scope><scope>ARAPS</scope><scope>AZQEC</scope><scope>BENPR</scope><scope>BGLVJ</scope><scope>CCPQU</scope><scope>D1I</scope><scope>DWQXO</scope><scope>GNUQQ</scope><scope>GUQSH</scope><scope>HCIFZ</scope><scope>KB.</scope><scope>L6V</scope><scope>M2O</scope><scope>M2P</scope><scope>M7S</scope><scope>MBDVC</scope><scope>P5Z</scope><scope>P62</scope><scope>PDBOC</scope><scope>PQEST</scope><scope>PQQKQ</scope><scope>PQUKI</scope><scope>PRINS</scope><scope>PTHSS</scope><scope>Q9U</scope><scope>S0X</scope></search><sort><creationdate>20071201</creationdate><title>On the Nature of the Interface between Ag^sub 3^Sn Intermetallics and Sn in Sn-3.5Ag Solder Alloys</title><author>Sidhu, Rajen S ; Madge, Shantanu V ; Deng, Xin ; Chawla, Nikhilesh</author></sort><facets><frbrtype>5</frbrtype><frbrgroupid>cdi_FETCH-proquest_journals_2049215683</frbrgroupid><rsrctype>articles</rsrctype><prefilter>articles</prefilter><language>eng</language><creationdate>2007</creationdate><topic>Alloys</topic><topic>Intermetallic compounds</topic><topic>Lead free solders</topic><topic>Soldering</topic><topic>Transmission electron microscopy</topic><toplevel>peer_reviewed</toplevel><toplevel>online_resources</toplevel><creatorcontrib>Sidhu, Rajen S</creatorcontrib><creatorcontrib>Madge, Shantanu V</creatorcontrib><creatorcontrib>Deng, Xin</creatorcontrib><creatorcontrib>Chawla, Nikhilesh</creatorcontrib><collection>ProQuest Central (Corporate)</collection><collection>ProQuest Central (purchase pre-March 2016)</collection><collection>Science Database (Alumni Edition)</collection><collection>STEM Database</collection><collection>ProQuest Pharma Collection</collection><collection>ProQuest SciTech Collection</collection><collection>ProQuest Technology Collection</collection><collection>ProQuest Central (Alumni) (purchase pre-March 2016)</collection><collection>Research Library (Alumni Edition)</collection><collection>Materials Science &amp; Engineering Collection</collection><collection>ProQuest Central (Alumni Edition)</collection><collection>ProQuest Central UK/Ireland</collection><collection>Advanced Technologies &amp; Aerospace Collection</collection><collection>ProQuest Central Essentials</collection><collection>ProQuest Central</collection><collection>Technology Collection (ProQuest)</collection><collection>ProQuest One Community College</collection><collection>ProQuest Materials Science Collection</collection><collection>ProQuest Central Korea</collection><collection>ProQuest Central Student</collection><collection>Research Library Prep</collection><collection>SciTech Premium Collection</collection><collection>Materials Science Database</collection><collection>ProQuest Engineering Collection</collection><collection>Research Library</collection><collection>Science Database (ProQuest)</collection><collection>Engineering Database</collection><collection>Research Library (Corporate)</collection><collection>Advanced Technologies &amp; Aerospace Database</collection><collection>ProQuest Advanced Technologies &amp; Aerospace Collection</collection><collection>Materials Science Collection</collection><collection>ProQuest One Academic Eastern Edition (DO NOT USE)</collection><collection>ProQuest One Academic</collection><collection>ProQuest One Academic UKI Edition</collection><collection>ProQuest Central China</collection><collection>Engineering Collection</collection><collection>ProQuest Central Basic</collection><collection>SIRS Editorial</collection><jtitle>Journal of electronic materials</jtitle></facets><delivery><delcategory>Remote Search Resource</delcategory><fulltext>fulltext</fulltext></delivery><addata><au>Sidhu, Rajen S</au><au>Madge, Shantanu V</au><au>Deng, Xin</au><au>Chawla, Nikhilesh</au><format>journal</format><genre>article</genre><ristype>JOUR</ristype><atitle>On the Nature of the Interface between Ag^sub 3^Sn Intermetallics and Sn in Sn-3.5Ag Solder Alloys</atitle><jtitle>Journal of electronic materials</jtitle><date>2007-12-01</date><risdate>2007</risdate><volume>36</volume><issue>12</issue><spage>1615</spage><pages>1615-</pages><issn>0361-5235</issn><eissn>1543-186X</eissn><coden>JECMA5</coden><abstract>We report on the nature of the orientation of Ag^sub 3^Sn and the Ag^sub 3^Sn/Sn interface in Sn-3.5Ag solder. Orientation imaging microscopy (OIM) and transmission electron microscopy (TEM) were used to characterize the orientation and nature of the interface, respectively. OIM and TEM showed that Sn-3.5Ag containing spherical Ag^sub 3^Sn particles does not have a preferred orientation with respect to the Sn matrix. However, needle-like Ag^sub 3^Sn formed during slower cooling appeared to have a preferred orientation within individual Sn colonies. The interface between Sn and Ag^sub 3^Sn appeared to be incoherent, as confirmed by high-resolution TEM analysis. [PUBLICATION ABSTRACT]</abstract><cop>Warrendale</cop><pub>Springer Nature B.V</pub></addata></record>
fulltext fulltext
identifier ISSN: 0361-5235
ispartof Journal of electronic materials, 2007-12, Vol.36 (12), p.1615
issn 0361-5235
1543-186X
language eng
recordid cdi_proquest_journals_204921568
source SpringerNature Journals
subjects Alloys
Intermetallic compounds
Lead free solders
Soldering
Transmission electron microscopy
title On the Nature of the Interface between Ag^sub 3^Sn Intermetallics and Sn in Sn-3.5Ag Solder Alloys
url https://sfx.bib-bvb.de/sfx_tum?ctx_ver=Z39.88-2004&ctx_enc=info:ofi/enc:UTF-8&ctx_tim=2024-12-13T07%3A52%3A28IST&url_ver=Z39.88-2004&url_ctx_fmt=infofi/fmt:kev:mtx:ctx&rfr_id=info:sid/primo.exlibrisgroup.com:primo3-Article-proquest&rft_val_fmt=info:ofi/fmt:kev:mtx:journal&rft.genre=article&rft.atitle=On%20the%20Nature%20of%20the%20Interface%20between%20Ag%5Esub%203%5ESn%20Intermetallics%20and%20Sn%20in%20Sn-3.5Ag%20Solder%20Alloys&rft.jtitle=Journal%20of%20electronic%20materials&rft.au=Sidhu,%20Rajen%20S&rft.date=2007-12-01&rft.volume=36&rft.issue=12&rft.spage=1615&rft.pages=1615-&rft.issn=0361-5235&rft.eissn=1543-186X&rft.coden=JECMA5&rft_id=info:doi/&rft_dat=%3Cproquest%3E1397299971%3C/proquest%3E%3Curl%3E%3C/url%3E&disable_directlink=true&sfx.directlink=off&sfx.report_link=0&rft_id=info:oai/&rft_pqid=204921568&rft_id=info:pmid/&rfr_iscdi=true