Seedless electrochemical deposition of copper on physical vapor deposition-W2N liner materials for ultra large scale integration (ULSI) devices

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Veröffentlicht in:	Journal of electronic materials 2001-12, Vol.30 (12), p.1602-1608
Hauptverfasser:	SHAW, Michael J, GRUNOW, Stephan, DUQUETTE, David J
Format:	Artikel
Sprache:	eng
Schlagworte:	Applied sciences Cross-disciplinary physics: materials science rheology Electrodeposition, electroplating Electronics Exact sciences and technology Materials science Metallization, contacts, interconnects device isolation Metals. Metallurgy Methods of deposition of films and coatings film growth and epitaxy Microelectronic fabrication (materials and surfaces technology) Physics Semiconductor electronics. Microelectronics. Optoelectronics. Solid state devices
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