82‐2: Substrate‐Free Flexible Electronics Manufacturing by Weak Bonding Method
By using weak bonding method, a flexible electronics either of organic or inorganic substrate formed on a rigid carrier glass can be directly separated from the carrier glass, with protection film‐assisted, by mechanical de‐bonding method. Without PI substrate, multi‐advantages are demonstrated for...
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| Veröffentlicht in: | SID International Symposium Digest of technical papers 2018-05, Vol.49 (1), p.1106-1109 |
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| container_end_page | 1109 |
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| container_issue | 1 |
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| container_title | SID International Symposium Digest of technical papers |
| container_volume | 49 |
| creator | Ke, Tsung-Ying Lee, Chih-Tsung Cheng, Kuei-Ning Su, Wei-Jen Kang, Ting Wang, Wan-Tsang Liu, Chun-Hsin Lin, Yu-Hsin |
| description | By using weak bonding method, a flexible electronics either of organic or inorganic substrate formed on a rigid carrier glass can be directly separated from the carrier glass, with protection film‐assisted, by mechanical de‐bonding method. Without PI substrate, multi‐advantages are demonstrated for flexible OLED display production. |
| doi_str_mv | 10.1002/sdtp.12121 |
| format | Article |
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| ispartof | SID International Symposium Digest of technical papers, 2018-05, Vol.49 (1), p.1106-1109 |
| issn | 0097-966X 2168-0159 |
| language | eng |
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| source | Wiley Online Library Journals Frontfile Complete |
| subjects | Bonding strength Debonding layer (DBL) Diodes Electronics Flexible components Mechanical debonding Organic light emitting diodes PI-free Protective coatings Stress Substrates Weak bonding |
| title | 82‐2: Substrate‐Free Flexible Electronics Manufacturing by Weak Bonding Method |
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