82‐2: Substrate‐Free Flexible Electronics Manufacturing by Weak Bonding Method

By using weak bonding method, a flexible electronics either of organic or inorganic substrate formed on a rigid carrier glass can be directly separated from the carrier glass, with protection film‐assisted, by mechanical de‐bonding method. Without PI substrate, multi‐advantages are demonstrated for...

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Veröffentlicht in:	SID International Symposium Digest of technical papers 2018-05, Vol.49 (1), p.1106-1109
Hauptverfasser:	Ke, Tsung-Ying, Lee, Chih-Tsung, Cheng, Kuei-Ning, Su, Wei-Jen, Kang, Ting, Wang, Wan-Tsang, Liu, Chun-Hsin, Lin, Yu-Hsin
Format:	Artikel
Sprache:	eng
Schlagworte:	Bonding strength Debonding layer (DBL) Diodes Electronics Flexible components Mechanical debonding Organic light emitting diodes PI-free Protective coatings Stress Substrates Weak bonding
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Beschreibung
Zusammenfassung:	By using weak bonding method, a flexible electronics either of organic or inorganic substrate formed on a rigid carrier glass can be directly separated from the carrier glass, with protection film‐assisted, by mechanical de‐bonding method. Without PI substrate, multi‐advantages are demonstrated for flexible OLED display production.
ISSN:	0097-966X 2168-0159
DOI:	10.1002/sdtp.12121