24‐3: Hot‐Melt‐Type Face‐Sealing Encapsulation for Flexible OLEDs

24‐3: Hot‐Melt‐Type Face‐Sealing Encapsulation for Flexible OLEDs

We have developed a face sealing sheet of flexible OLED in which hygroscopic particles are dispersed, based on a hot melt type adhesive. By using this sheet in combination with a gas barrier film, degradation of emitting area of OLED was suppressed. Also, it offers transparency, flexibility and adhe...

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Veröffentlicht in:SID International Symposium Digest of technical papers 2018-05, Vol.49 (1), p.306-309
Hauptverfasser: Inoue, Hiroyasu, Murata, Naoki, Harai, Kenichi, Kashiwagi, Motofumi
Format: Artikel
Sprache:eng
Schlagworte:
barrier film
encapsulation
face-sealing
flexible
hot-melt
hygroscopic particle
Organic light emitting diodes
Sealing
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Zusammenfassung:We have developed a face sealing sheet of flexible OLED in which hygroscopic particles are dispersed, based on a hot melt type adhesive. By using this sheet in combination with a gas barrier film, degradation of emitting area of OLED was suppressed. Also, it offers transparency, flexibility and adhesion.
ISSN:0097-966X
2168-0159
DOI:10.1002/sdtp.12547