P‐62: The Process and Characteristic of new High Thickness Negative Photoresist

In this paper, the process and characteristic of a new kind of high thickness negative photoresist were studied. Through process optimization, the 60~110um height post spacer (PS) was achieved successfully in 5.5G production line. The PS morphology was in good condition and the elastic recovery rate...

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Veröffentlicht in:	SID International Symposium Digest of technical papers 2018-05, Vol.49 (1), p.1433-1435
Hauptverfasser:	Zhang, Jiaxiang, Wang, Yanqiang, Tong, Shuo, Zhou, Yongshan, Feng, Longqiang, Qing, Yifeng, Lu, Kai, Huang, Dongsheng, Chen, Si, Wang, Wei
Format:	Artikel
Sprache:	eng
Schlagworte:	Dosage Elastic recovery Elastic recovery rate Film uniformity High Thickness Negative Photoresist LCD antenna Liquid crystal lens Morphology PS morphology
Online-Zugang:	Volltext
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