P‐62: The Process and Characteristic of new High Thickness Negative Photoresist

In this paper, the process and characteristic of a new kind of high thickness negative photoresist were studied. Through process optimization, the 60~110um height post spacer (PS) was achieved successfully in 5.5G production line. The PS morphology was in good condition and the elastic recovery rate could more than 90%.This paper also studied the influence on the PS at different dose quantity. The dose quantity had little influence on PS morphology, but a large effect on the elastic recovery rate. When the dose quantity was greater than 400mj, the elastic recovery rate could achieve the best state.