An insight into the dopant selection for CeO2-based resistive-switching memory system: a DFT and experimental study
The aim of this study is to figure out better metal dopants for CeO 2 for designing highly efficient non-volatile memory (NVM) devices. The present DFT work involves four different metals doped interstitially and substitutionally in CeO 2 thin films. First principle calculations involve electron den...
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Veröffentlicht in: | Applied nanoscience 2018-04, Vol.8 (4), p.839-851 |
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Hauptverfasser: | , , , , , , , , |
Format: | Artikel |
Sprache: | eng |
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Zusammenfassung: | The aim of this study is to figure out better metal dopants for CeO
2
for designing highly efficient non-volatile memory (NVM) devices. The present DFT work involves four different metals doped interstitially and substitutionally in CeO
2
thin films. First principle calculations involve electron density of states (DOS) and partial density of states (PDOS), and isosurface charge densities are carried out within the plane-wave density functional theory using GGA and GGA +
U
approach by employing the Vienna ab initio simulation package VASP. Isosurface charge density plots confirmed that interstitial doping of Zr and Ti metals truly assists in generating conduction filaments (CFs), while substitutional doping of these metals cannot do so. Substitutional doping of W may contribute in generating CFs in CeO
2
directly, but its interstitial doping improves conductivity of CeO
2
. However, Ni-dopant is capable of directly generating CFs both as substitutional and interstitial dopants in ceria. Such a capability of Ni appears acting as top electrode in Ni/CeO
2
/Pt memory devices, but its RS behavior is not so good. On inserting Zr layer to make Ni/Zr:CeO
2
/Pt memory stacks, Ni does not contribute in RS characteristics, but Zr plays a vital role in forming CFs by creating oxygen vacancies and forming ZrO
2
interfacial layer. Therefore, Zr-doped devices exhibit high-resistance ratio of ~ 10
4
and good endurance as compared to undoped devices suitable for RRAM applications. |
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ISSN: | 2190-5509 2190-5517 |
DOI: | 10.1007/s13204-018-0751-7 |