A 0.18- \mu \text CMOS Image Sensor With Phase-Delay-Counting and Oversampling Dual-Slope Integrating Column ADCs Achieving 1}^} Noise at 3.8- \mu \text Conversion Time
A CMOS image sensor (CIS) is presented, simultaneously achieving low noise and high frame rate. The imager innovatively employs column-parallel dual-slope (DS) integrating analog-to-digital converters (ADCs) based on a phase-delay-counting principle and using oversampling to suppress the readout the...
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Veröffentlicht in: | IEEE journal of solid-state circuits 2018-02, Vol.53 (2), p.515-526 |
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creator | Ha Le-Thai Chapinal, Genis Geurts, Tomas Gielen, Georges G. E. |
description | A CMOS image sensor (CIS) is presented, simultaneously achieving low noise and high frame rate. The imager innovatively employs column-parallel dual-slope (DS) integrating analog-to-digital converters (ADCs) based on a phase-delay-counting principle and using oversampling to suppress the readout thermal noise. A noise analysis of the DS-integrating ADC in correlated-double-sampling operation is provided to prove the low-noise advantage of the proposed architecture. Furthermore, the design considerations of the presented architecture are derived based on the analysis of nonideality effects. Based on these analytical results, design tradeoffs are discussed and applied in the test chip. The test chip, fabricated in a 4M1P 0.18-μm CIS technology, contains a 128 × 128 pixel array. The measurement results show that each of the 128 column-level ADCs converts a pixel in 3.8 μs and achieves a noise floor of 1e rms - . The chip consumes 49 mW excluding the I/O power and 59 mW including the I/O power, resulting in a very good figure of merit value of 1.4 and 1.7 [e - .nJ], respectively. |
doi_str_mv | 10.1109/JSSC.2017.2751610 |
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E.</creator><creatorcontrib>Ha Le-Thai ; Chapinal, Genis ; Geurts, Tomas ; Gielen, Georges G. E.</creatorcontrib><description>A CMOS image sensor (CIS) is presented, simultaneously achieving low noise and high frame rate. The imager innovatively employs column-parallel dual-slope (DS) integrating analog-to-digital converters (ADCs) based on a phase-delay-counting principle and using oversampling to suppress the readout thermal noise. A noise analysis of the DS-integrating ADC in correlated-double-sampling operation is provided to prove the low-noise advantage of the proposed architecture. Furthermore, the design considerations of the presented architecture are derived based on the analysis of nonideality effects. Based on these analytical results, design tradeoffs are discussed and applied in the test chip. The test chip, fabricated in a 4M1P 0.18-μm CIS technology, contains a 128 × 128 pixel array. The measurement results show that each of the 128 column-level ADCs converts a pixel in 3.8 μs and achieves a noise floor of 1e rms - . The chip consumes 49 mW excluding the I/O power and 59 mW including the I/O power, resulting in a very good figure of merit value of 1.4 and 1.7 [e - .nJ], respectively.</description><identifier>ISSN: 0018-9200</identifier><identifier>EISSN: 1558-173X</identifier><identifier>DOI: 10.1109/JSSC.2017.2751610</identifier><identifier>CODEN: IJSCBC</identifier><language>eng</language><publisher>New York: IEEE</publisher><subject>Analog to digital conversion ; Analog to digital converters ; Architecture ; CMOS ; CMOS image sensors ; Column analog-to-digital converters (ADCs) ; Delay ; Digital cameras ; DS ADC ; DS integrating ADC ; dual slope (DS) ; Figure of merit ; high speed ; image sensors ; jitter ; Low noise ; Noise ; Oversampling ; phase counting ; Pixels ; Power consumption ; Radiation detectors ; Ring oscillators ; settling time ; Thermal noise ; Timing</subject><ispartof>IEEE journal of solid-state circuits, 2018-02, Vol.53 (2), p.515-526</ispartof><rights>Copyright The Institute of Electrical and Electronics Engineers, Inc. (IEEE) 2018</rights><lds50>peer_reviewed</lds50><woscitedreferencessubscribed>false</woscitedreferencessubscribed><citedby>FETCH-LOGICAL-c1385-baf6d51732254bad56f099a5d8084775071c391b58eb9f12615b1b216fa1877e3</citedby><cites>FETCH-LOGICAL-c1385-baf6d51732254bad56f099a5d8084775071c391b58eb9f12615b1b216fa1877e3</cites><orcidid>0000-0002-7938-3336</orcidid></display><links><openurl>$$Topenurl_article</openurl><openurlfulltext>$$Topenurlfull_article</openurlfulltext><thumbnail>$$Tsyndetics_thumb_exl</thumbnail><linktohtml>$$Uhttps://ieeexplore.ieee.org/document/8065020$$EHTML$$P50$$Gieee$$H</linktohtml><link.rule.ids>314,780,784,796,27924,27925,54758</link.rule.ids><linktorsrc>$$Uhttps://ieeexplore.ieee.org/document/8065020$$EView_record_in_IEEE$$FView_record_in_$$GIEEE</linktorsrc></links><search><creatorcontrib>Ha Le-Thai</creatorcontrib><creatorcontrib>Chapinal, Genis</creatorcontrib><creatorcontrib>Geurts, Tomas</creatorcontrib><creatorcontrib>Gielen, Georges G. E.</creatorcontrib><title>A 0.18- \mu \text CMOS Image Sensor With Phase-Delay-Counting and Oversampling Dual-Slope Integrating Column ADCs Achieving 1}^} Noise at 3.8- \mu \text Conversion Time</title><title>IEEE journal of solid-state circuits</title><addtitle>JSSC</addtitle><description>A CMOS image sensor (CIS) is presented, simultaneously achieving low noise and high frame rate. The imager innovatively employs column-parallel dual-slope (DS) integrating analog-to-digital converters (ADCs) based on a phase-delay-counting principle and using oversampling to suppress the readout thermal noise. A noise analysis of the DS-integrating ADC in correlated-double-sampling operation is provided to prove the low-noise advantage of the proposed architecture. Furthermore, the design considerations of the presented architecture are derived based on the analysis of nonideality effects. Based on these analytical results, design tradeoffs are discussed and applied in the test chip. The test chip, fabricated in a 4M1P 0.18-μm CIS technology, contains a 128 × 128 pixel array. The measurement results show that each of the 128 column-level ADCs converts a pixel in 3.8 μs and achieves a noise floor of 1e rms - . The chip consumes 49 mW excluding the I/O power and 59 mW including the I/O power, resulting in a very good figure of merit value of 1.4 and 1.7 [e - .nJ], respectively.</description><subject>Analog to digital conversion</subject><subject>Analog to digital converters</subject><subject>Architecture</subject><subject>CMOS</subject><subject>CMOS image sensors</subject><subject>Column analog-to-digital converters (ADCs)</subject><subject>Delay</subject><subject>Digital cameras</subject><subject>DS ADC</subject><subject>DS integrating ADC</subject><subject>dual slope (DS)</subject><subject>Figure of merit</subject><subject>high speed</subject><subject>image sensors</subject><subject>jitter</subject><subject>Low noise</subject><subject>Noise</subject><subject>Oversampling</subject><subject>phase counting</subject><subject>Pixels</subject><subject>Power consumption</subject><subject>Radiation detectors</subject><subject>Ring oscillators</subject><subject>settling time</subject><subject>Thermal noise</subject><subject>Timing</subject><issn>0018-9200</issn><issn>1558-173X</issn><fulltext>true</fulltext><rsrctype>article</rsrctype><creationdate>2018</creationdate><recordtype>article</recordtype><sourceid>RIE</sourceid><recordid>eNpVkc9u00AQxleISoSWB0BcRuK8YWed9a6PkcOfoEKQXASHCmudjBNX9m7YtSt66PvwmNikqtTTaEbf982Mfoy9RjFHFNm7z0WRz6VAPZdaYYriGZuhUoajTn4-ZzMh0PBMCvGCvYzxZmwXC4Mz9ncJY4LhcN0NcN3Tnx7yL5sC1p3dExTkog_wo-kP8O1gI_EVtfaO535wfeP2YN0ONrcUou2O7TRYDbblReuPBGvX0z7Y_7rct0PnYLnKIyy3h4Zupyne_7qHr76JBLaHZP70DO-m4MY7uGo6umBntW0jvXqo5-z7h_dX-Sd-ufm4zpeXfIuJUbyydbpT49NSqkVldyqtRZZZtTPCLLRWQuM2ybBShqqsRpmiqrCSmNYWjdaUnLO3p9xj8L8Hin1544fgxpUlZplE1BrVqMKTaht8jIHq8hiazoa7EkU5ASknIOUEpHwAMnrenDwNET3qjUiVkCL5B_OnhNs</recordid><startdate>201802</startdate><enddate>201802</enddate><creator>Ha Le-Thai</creator><creator>Chapinal, Genis</creator><creator>Geurts, Tomas</creator><creator>Gielen, Georges G. E.</creator><general>IEEE</general><general>The Institute of Electrical and Electronics Engineers, Inc. (IEEE)</general><scope>97E</scope><scope>RIA</scope><scope>RIE</scope><scope>AAYXX</scope><scope>CITATION</scope><scope>7SP</scope><scope>8FD</scope><scope>L7M</scope><orcidid>https://orcid.org/0000-0002-7938-3336</orcidid></search><sort><creationdate>201802</creationdate><title>A 0.18- \mu \text CMOS Image Sensor With Phase-Delay-Counting and Oversampling Dual-Slope Integrating Column ADCs Achieving 1}^} Noise at 3.8- \mu \text Conversion Time</title><author>Ha Le-Thai ; Chapinal, Genis ; Geurts, Tomas ; Gielen, Georges G. 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E.</au><format>journal</format><genre>article</genre><ristype>JOUR</ristype><atitle>A 0.18- \mu \text CMOS Image Sensor With Phase-Delay-Counting and Oversampling Dual-Slope Integrating Column ADCs Achieving 1}^} Noise at 3.8- \mu \text Conversion Time</atitle><jtitle>IEEE journal of solid-state circuits</jtitle><stitle>JSSC</stitle><date>2018-02</date><risdate>2018</risdate><volume>53</volume><issue>2</issue><spage>515</spage><epage>526</epage><pages>515-526</pages><issn>0018-9200</issn><eissn>1558-173X</eissn><coden>IJSCBC</coden><abstract>A CMOS image sensor (CIS) is presented, simultaneously achieving low noise and high frame rate. The imager innovatively employs column-parallel dual-slope (DS) integrating analog-to-digital converters (ADCs) based on a phase-delay-counting principle and using oversampling to suppress the readout thermal noise. A noise analysis of the DS-integrating ADC in correlated-double-sampling operation is provided to prove the low-noise advantage of the proposed architecture. Furthermore, the design considerations of the presented architecture are derived based on the analysis of nonideality effects. Based on these analytical results, design tradeoffs are discussed and applied in the test chip. The test chip, fabricated in a 4M1P 0.18-μm CIS technology, contains a 128 × 128 pixel array. The measurement results show that each of the 128 column-level ADCs converts a pixel in 3.8 μs and achieves a noise floor of 1e rms - . The chip consumes 49 mW excluding the I/O power and 59 mW including the I/O power, resulting in a very good figure of merit value of 1.4 and 1.7 [e - .nJ], respectively.</abstract><cop>New York</cop><pub>IEEE</pub><doi>10.1109/JSSC.2017.2751610</doi><tpages>12</tpages><orcidid>https://orcid.org/0000-0002-7938-3336</orcidid></addata></record> |
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subjects | Analog to digital conversion Analog to digital converters Architecture CMOS CMOS image sensors Column analog-to-digital converters (ADCs) Delay Digital cameras DS ADC DS integrating ADC dual slope (DS) Figure of merit high speed image sensors jitter Low noise Noise Oversampling phase counting Pixels Power consumption Radiation detectors Ring oscillators settling time Thermal noise Timing |
title | A 0.18- \mu \text CMOS Image Sensor With Phase-Delay-Counting and Oversampling Dual-Slope Integrating Column ADCs Achieving 1}^} Noise at 3.8- \mu \text Conversion Time |
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