Detailed survey on minimum activation energy for penetration of Ni nanoparticles into Bi-2223 crystal structure and temperature-dependent Ni diffusivity

The primary contributions of this study are not only to explore the role of diffusion annealing temperature interval 650 to 850 °C on the formation of effective electron–phonon coupling or cooper-pair probabilities (percentage of clusters in the superconducting path), densities of active and dynamic...

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Veröffentlicht in:Journal of materials science. Materials in electronics 2018-02, Vol.29 (4), p.3239-3249
Hauptverfasser: Zalaoglu, Yusuf, Terzioglu, Cabir, Turgay, Tahsin, Yildirim, Gurcan
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creator Zalaoglu, Yusuf
Terzioglu, Cabir
Turgay, Tahsin
Yildirim, Gurcan
description The primary contributions of this study are not only to explore the role of diffusion annealing temperature interval 650 to 850 °C on the formation of effective electron–phonon coupling or cooper-pair probabilities (percentage of clusters in the superconducting path), densities of active and dynamic electronic states at Fermi energy level, stabilization of superconductivity in the homogeneous regions, overlapping of Cu-3d and O-2p wave functions and bond strengths in the crystal matrix of Ni surface-layered Bi-2223 polycrystalline ceramics, but also to determine the temperature-dependent diffusion fast-rate and required minimum activation energy for the diffusion of Ni foreign impurities into the bulk Bi-2223 superconducting crystal structure for the first time. The dc electrical measurement results obtained show that the optimum diffusion annealing temperature is found to be 700 °C for the penetration of optimum Ni concentration into the Bi-2223 crystal lattice so that the ceramic compound exposed to 700 °C annealing temperature exhibits the highest electrical and superconducting properties. In this respect, the material with the minimum electrical resistivity parameters of Δ ρ, ρ 115K , ρ res and ρ norm obtains the maximum superconducting characteristics of T c o n s e t , T c o f f s e t and RRR . Accordingly, the annealing temperature of 700 °C promotes the Bi-2223 ceramics for usage in the engineering, electro-optic, industrial and large scale applications. At the same time, the diffusion coefficients [D = D o exp(E/k B T)] determined at annealing temperature ranging from 650 to 850 °C are observed to be much more significant at rather higher temperatures as compared to lower temperatures. The temperature-dependent Ni diffusion coefficient is determined to be D = 3.9707 × 10 − 7 exp[− 1.132 eV/k B T] for the Bi-2223 particulate solid material. Namely, the diffusion coefficient is calculated to be about 3.9707 × 10 − 7 cm 2  s − 1 when the required minimum activation energy for the introduction of heavy metal Ni ions to the bulk Bi-2223 crystal structure is computed to be about 1.132 eV, being one of the most striking points deduced form this work.
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The dc electrical measurement results obtained show that the optimum diffusion annealing temperature is found to be 700 °C for the penetration of optimum Ni concentration into the Bi-2223 crystal lattice so that the ceramic compound exposed to 700 °C annealing temperature exhibits the highest electrical and superconducting properties. In this respect, the material with the minimum electrical resistivity parameters of Δ ρ, ρ 115K , ρ res and ρ norm obtains the maximum superconducting characteristics of T c o n s e t , T c o f f s e t and RRR . Accordingly, the annealing temperature of 700 °C promotes the Bi-2223 ceramics for usage in the engineering, electro-optic, industrial and large scale applications. At the same time, the diffusion coefficients [D = D o exp(E/k B T)] determined at annealing temperature ranging from 650 to 850 °C are observed to be much more significant at rather higher temperatures as compared to lower temperatures. The temperature-dependent Ni diffusion coefficient is determined to be D = 3.9707 × 10 − 7 exp[− 1.132 eV/k B T] for the Bi-2223 particulate solid material. Namely, the diffusion coefficient is calculated to be about 3.9707 × 10 − 7 cm 2  s − 1 when the required minimum activation energy for the introduction of heavy metal Ni ions to the bulk Bi-2223 crystal structure is computed to be about 1.132 eV, being one of the most striking points deduced form this work.</description><identifier>ISSN: 0957-4522</identifier><identifier>EISSN: 1573-482X</identifier><identifier>DOI: 10.1007/s10854-017-8259-6</identifier><language>eng</language><publisher>New York: Springer US</publisher><subject>Activation energy ; Annealing ; Bismuth strontium calcium copper oxide ; Ceramic bonding ; Ceramics industry ; Characterization and Evaluation of Materials ; Chemistry and Materials Science ; Crystal lattices ; Crystal structure ; Diffusion annealing ; Diffusion coefficient ; Diffusion layers ; Diffusion rate ; Electrical measurement ; Electron states ; Energy levels ; Fermi surfaces ; Heavy metals ; Materials Science ; Mathematical analysis ; Nickel ; Optical and Electronic Materials ; Penetration ; Superconductivity ; Temperature ; Wave functions</subject><ispartof>Journal of materials science. 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Materials in electronics</title><addtitle>J Mater Sci: Mater Electron</addtitle><description>The primary contributions of this study are not only to explore the role of diffusion annealing temperature interval 650 to 850 °C on the formation of effective electron–phonon coupling or cooper-pair probabilities (percentage of clusters in the superconducting path), densities of active and dynamic electronic states at Fermi energy level, stabilization of superconductivity in the homogeneous regions, overlapping of Cu-3d and O-2p wave functions and bond strengths in the crystal matrix of Ni surface-layered Bi-2223 polycrystalline ceramics, but also to determine the temperature-dependent diffusion fast-rate and required minimum activation energy for the diffusion of Ni foreign impurities into the bulk Bi-2223 superconducting crystal structure for the first time. The dc electrical measurement results obtained show that the optimum diffusion annealing temperature is found to be 700 °C for the penetration of optimum Ni concentration into the Bi-2223 crystal lattice so that the ceramic compound exposed to 700 °C annealing temperature exhibits the highest electrical and superconducting properties. In this respect, the material with the minimum electrical resistivity parameters of Δ ρ, ρ 115K , ρ res and ρ norm obtains the maximum superconducting characteristics of T c o n s e t , T c o f f s e t and RRR . Accordingly, the annealing temperature of 700 °C promotes the Bi-2223 ceramics for usage in the engineering, electro-optic, industrial and large scale applications. At the same time, the diffusion coefficients [D = D o exp(E/k B T)] determined at annealing temperature ranging from 650 to 850 °C are observed to be much more significant at rather higher temperatures as compared to lower temperatures. The temperature-dependent Ni diffusion coefficient is determined to be D = 3.9707 × 10 − 7 exp[− 1.132 eV/k B T] for the Bi-2223 particulate solid material. 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Materials in electronics</jtitle><stitle>J Mater Sci: Mater Electron</stitle><date>2018-02-01</date><risdate>2018</risdate><volume>29</volume><issue>4</issue><spage>3239</spage><epage>3249</epage><pages>3239-3249</pages><issn>0957-4522</issn><eissn>1573-482X</eissn><abstract>The primary contributions of this study are not only to explore the role of diffusion annealing temperature interval 650 to 850 °C on the formation of effective electron–phonon coupling or cooper-pair probabilities (percentage of clusters in the superconducting path), densities of active and dynamic electronic states at Fermi energy level, stabilization of superconductivity in the homogeneous regions, overlapping of Cu-3d and O-2p wave functions and bond strengths in the crystal matrix of Ni surface-layered Bi-2223 polycrystalline ceramics, but also to determine the temperature-dependent diffusion fast-rate and required minimum activation energy for the diffusion of Ni foreign impurities into the bulk Bi-2223 superconducting crystal structure for the first time. The dc electrical measurement results obtained show that the optimum diffusion annealing temperature is found to be 700 °C for the penetration of optimum Ni concentration into the Bi-2223 crystal lattice so that the ceramic compound exposed to 700 °C annealing temperature exhibits the highest electrical and superconducting properties. In this respect, the material with the minimum electrical resistivity parameters of Δ ρ, ρ 115K , ρ res and ρ norm obtains the maximum superconducting characteristics of T c o n s e t , T c o f f s e t and RRR . Accordingly, the annealing temperature of 700 °C promotes the Bi-2223 ceramics for usage in the engineering, electro-optic, industrial and large scale applications. At the same time, the diffusion coefficients [D = D o exp(E/k B T)] determined at annealing temperature ranging from 650 to 850 °C are observed to be much more significant at rather higher temperatures as compared to lower temperatures. The temperature-dependent Ni diffusion coefficient is determined to be D = 3.9707 × 10 − 7 exp[− 1.132 eV/k B T] for the Bi-2223 particulate solid material. Namely, the diffusion coefficient is calculated to be about 3.9707 × 10 − 7 cm 2  s − 1 when the required minimum activation energy for the introduction of heavy metal Ni ions to the bulk Bi-2223 crystal structure is computed to be about 1.132 eV, being one of the most striking points deduced form this work.</abstract><cop>New York</cop><pub>Springer US</pub><doi>10.1007/s10854-017-8259-6</doi><tpages>11</tpages></addata></record>
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subjects Activation energy
Annealing
Bismuth strontium calcium copper oxide
Ceramic bonding
Ceramics industry
Characterization and Evaluation of Materials
Chemistry and Materials Science
Crystal lattices
Crystal structure
Diffusion annealing
Diffusion coefficient
Diffusion layers
Diffusion rate
Electrical measurement
Electron states
Energy levels
Fermi surfaces
Heavy metals
Materials Science
Mathematical analysis
Nickel
Optical and Electronic Materials
Penetration
Superconductivity
Temperature
Wave functions
title Detailed survey on minimum activation energy for penetration of Ni nanoparticles into Bi-2223 crystal structure and temperature-dependent Ni diffusivity
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