Detailed survey on minimum activation energy for penetration of Ni nanoparticles into Bi-2223 crystal structure and temperature-dependent Ni diffusivity
The primary contributions of this study are not only to explore the role of diffusion annealing temperature interval 650 to 850 °C on the formation of effective electron–phonon coupling or cooper-pair probabilities (percentage of clusters in the superconducting path), densities of active and dynamic...
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Veröffentlicht in: | Journal of materials science. Materials in electronics 2018-02, Vol.29 (4), p.3239-3249 |
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Sprache: | eng |
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Zusammenfassung: | The primary contributions of this study are not only to explore the role of diffusion annealing temperature interval 650 to 850 °C on the formation of effective electron–phonon coupling or cooper-pair probabilities (percentage of clusters in the superconducting path), densities of active and dynamic electronic states at Fermi energy level, stabilization of superconductivity in the homogeneous regions, overlapping of Cu-3d and O-2p wave functions and bond strengths in the crystal matrix of Ni surface-layered Bi-2223 polycrystalline ceramics, but also to determine the temperature-dependent diffusion fast-rate and required minimum activation energy for the diffusion of Ni foreign impurities into the bulk Bi-2223 superconducting crystal structure for the first time. The dc electrical measurement results obtained show that the optimum diffusion annealing temperature is found to be 700 °C for the penetration of optimum Ni concentration into the Bi-2223 crystal lattice so that the ceramic compound exposed to 700 °C annealing temperature exhibits the highest electrical and superconducting properties. In this respect, the material with the minimum electrical resistivity parameters of Δ
ρ, ρ
115K
,
ρ
res
and
ρ
norm
obtains the maximum superconducting characteristics of
T
c
o
n
s
e
t
,
T
c
o
f
f
s
e
t
and
RRR
. Accordingly, the annealing temperature of 700 °C promotes the Bi-2223 ceramics for usage in the engineering, electro-optic, industrial and large scale applications. At the same time, the diffusion coefficients [D = D
o
exp(E/k
B
T)] determined at annealing temperature ranging from 650 to 850 °C are observed to be much more significant at rather higher temperatures as compared to lower temperatures. The temperature-dependent Ni diffusion coefficient is determined to be D = 3.9707 × 10
− 7
exp[− 1.132 eV/k
B
T] for the Bi-2223 particulate solid material. Namely, the diffusion coefficient is calculated to be about 3.9707 × 10
− 7
cm
2
s
− 1
when the required minimum activation energy for the introduction of heavy metal Ni ions to the bulk Bi-2223 crystal structure is computed to be about 1.132 eV, being one of the most striking points deduced form this work. |
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ISSN: | 0957-4522 1573-482X |
DOI: | 10.1007/s10854-017-8259-6 |