The Effect of Aging on the Microstructure of Selective Laser Melted Cu-Ni-Si

Precipitation hardening copper alloy C70250 was selectively laser melted to successfully produce components around 98 pct dense with high mechanical strength and electrical conductivity. Aging heat treatments were carried out at 723 K (450 °C) directly on as-printed samples up to 128 hours. Mechanical testing found that peak yield strength of around 590 MPa could be attained with an electrical conductivity of 34.2 pct IACS after 8 hours of aging. Conductivity continues to increase with further aging while the peak strength appears to be less sensitive to aging time exhibiting a broad range of time where near-peak properties exist. After aging for 128 hours, there is a drop in yield strength to 546 MPa with an increase in conductivity to 43.2 pct IACS. Electron microscopy analysis revealed nanometer-scale silicon-rich oxide particles throughout the material that persist during aging. Deformation twinning is observed in the peak-age condition after tensile testing and several strengthening mechanisms appear to be active to varying degrees throughout aging which account for the broad range of aging time where nearly the peak mechanical properties exist.