Pulsed KrF laser-assisted direct deposition of graphitic capping layer for Cu interconnect

A graphitic capping layer was successfully formed on top of Cu interconnects at room temperature, using a pulsed KrF laser. The change in temperature of the Cu line was maintained below 380 °C during laser irradiation with a fluence of 312.5 mJ/cm2. The resistance and critical current density of graphitic layer-capped Cu interconnects were improved by 2.8% and 5.2%, respectively. The lifetime of graphitic layer-capped Cu interconnects under a constant current stress was improved by 223%. [Display omitted]