Length scale effect on the thermal stability of nanoscale Cu/Ag multilayers
The annealing induced grain growth (GG) and heterogeneous interface evolution of Cu/Ag multilayers with individual layer thickness (h) varying from 5 to 50nm were investigated by transmission electron microscopy (TEM). The results demonstrate that the thermal stability of Cu/Ag multilayers exhibits...
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| Veröffentlicht in: | Materials science & engineering. A, Structural materials : properties, microstructure and processing Structural materials : properties, microstructure and processing, 2017-02, Vol.686, p.142-149 |
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| container_title | Materials science & engineering. A, Structural materials : properties, microstructure and processing |
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| creator | Ma, Y.J. Wei, M.Z. Sun, C. Cao, Z.H. Meng, X.K. |
| description | The annealing induced grain growth (GG) and heterogeneous interface evolution of Cu/Ag multilayers with individual layer thickness (h) varying from 5 to 50nm were investigated by transmission electron microscopy (TEM). The results demonstrate that the thermal stability of Cu/Ag multilayers exhibits strong length scale dependence. For samples with h |
| doi_str_mv | 10.1016/j.msea.2017.01.048 |
| format | Article |
| fullrecord | <record><control><sourceid>proquest_cross</sourceid><recordid>TN_cdi_proquest_journals_1942728221</recordid><sourceformat>XML</sourceformat><sourcesystem>PC</sourcesystem><els_id>S0921509317300576</els_id><sourcerecordid>1942728221</sourcerecordid><originalsourceid>FETCH-LOGICAL-c328t-615066c5e14f7b496970b2cd9239e519811b44c087861aef8d6b539236039ff63</originalsourceid><addsrcrecordid>eNp9kE1LxDAQhoMouK7-AU8Fz-3OpG3agJdl8QsXvOg5pOlkt6Ufa9IK--9tqWcPwxzmfWaGh7F7hAgBxaaOWk864oBZBBhBkl-wFeZZHCYyFpdsBZJjmIKMr9mN9zUAYALpir3vqTsMx8Ab3VBA1pIZgr4LhiPN5VrdBH7QRdVUwznobdDprl_Cu3GzPQTt2AxVo8_k_C27srrxdPfX1-zr-elz9xruP17edtt9aGKeD6HAFIQwKWFisyKRQmZQcFNKHktKUeaIRZIYyLNcoCabl6JI42kqIJbWinjNHpa9J9d_j-QHVfej66aTCmXCM55zjlOKLynjeu8dWXVyVavdWSGoWZqq1SxNzdIUoJqkTdDjAtH0_09FTnlTUWeorNxkRpV99R_-C7ntc64</addsrcrecordid><sourcetype>Aggregation Database</sourcetype><iscdi>true</iscdi><recordtype>article</recordtype><pqid>1942728221</pqid></control><display><type>article</type><title>Length scale effect on the thermal stability of nanoscale Cu/Ag multilayers</title><source>Elsevier ScienceDirect Journals</source><creator>Ma, Y.J. ; Wei, M.Z. ; Sun, C. ; Cao, Z.H. ; Meng, X.K.</creator><creatorcontrib>Ma, Y.J. ; Wei, M.Z. ; Sun, C. ; Cao, Z.H. ; Meng, X.K.</creatorcontrib><description>The annealing induced grain growth (GG) and heterogeneous interface evolution of Cu/Ag multilayers with individual layer thickness (h) varying from 5 to 50nm were investigated by transmission electron microscopy (TEM). The results demonstrate that the thermal stability of Cu/Ag multilayers exhibits strong length scale dependence. For samples with h<20nm, the heterogeneous interfaces completely disappear when the annealing temperature exceeds 200°C. However, the temperature for stable layered structure can reach 300°C as the h≥20nm, where the interfaces remain remarkably intact. The existence of a large number of grain boundaries (GBs) decrease the stability of multilayers, while more heterogeneous interfaces contribute to resisting atomic diffusion, inhibiting GG. The equilibrium is achieved by a competitive process between GBs diffusion and heterogeneous interfaces resistance. Moreover, the formation of annealing twins in multilayer also significantly improve the microstructural stability.</description><identifier>ISSN: 0921-5093</identifier><identifier>EISSN: 1873-4936</identifier><identifier>DOI: 10.1016/j.msea.2017.01.048</identifier><language>eng</language><publisher>Lausanne: Elsevier B.V</publisher><subject>Annealing ; Atomic structure ; Diffusion ; Electron microscopy ; Grain boundaries ; Grain growth ; Heterogeneous interface ; Interface stability ; Metallic multilayers ; Multilayers ; Scale effect ; Thermal stability ; Thickness ; Transmission electron microscopy</subject><ispartof>Materials science & engineering. A, Structural materials : properties, microstructure and processing, 2017-02, Vol.686, p.142-149</ispartof><rights>2017 Elsevier B.V.</rights><rights>Copyright Elsevier BV Feb 16, 2017</rights><lds50>peer_reviewed</lds50><woscitedreferencessubscribed>false</woscitedreferencessubscribed><citedby>FETCH-LOGICAL-c328t-615066c5e14f7b496970b2cd9239e519811b44c087861aef8d6b539236039ff63</citedby><cites>FETCH-LOGICAL-c328t-615066c5e14f7b496970b2cd9239e519811b44c087861aef8d6b539236039ff63</cites></display><links><openurl>$$Topenurl_article</openurl><openurlfulltext>$$Topenurlfull_article</openurlfulltext><thumbnail>$$Tsyndetics_thumb_exl</thumbnail><linktohtml>$$Uhttps://dx.doi.org/10.1016/j.msea.2017.01.048$$EHTML$$P50$$Gelsevier$$H</linktohtml><link.rule.ids>314,776,780,3536,27903,27904,45974</link.rule.ids></links><search><creatorcontrib>Ma, Y.J.</creatorcontrib><creatorcontrib>Wei, M.Z.</creatorcontrib><creatorcontrib>Sun, C.</creatorcontrib><creatorcontrib>Cao, Z.H.</creatorcontrib><creatorcontrib>Meng, X.K.</creatorcontrib><title>Length scale effect on the thermal stability of nanoscale Cu/Ag multilayers</title><title>Materials science & engineering. A, Structural materials : properties, microstructure and processing</title><description>The annealing induced grain growth (GG) and heterogeneous interface evolution of Cu/Ag multilayers with individual layer thickness (h) varying from 5 to 50nm were investigated by transmission electron microscopy (TEM). The results demonstrate that the thermal stability of Cu/Ag multilayers exhibits strong length scale dependence. For samples with h<20nm, the heterogeneous interfaces completely disappear when the annealing temperature exceeds 200°C. However, the temperature for stable layered structure can reach 300°C as the h≥20nm, where the interfaces remain remarkably intact. The existence of a large number of grain boundaries (GBs) decrease the stability of multilayers, while more heterogeneous interfaces contribute to resisting atomic diffusion, inhibiting GG. The equilibrium is achieved by a competitive process between GBs diffusion and heterogeneous interfaces resistance. Moreover, the formation of annealing twins in multilayer also significantly improve the microstructural stability.</description><subject>Annealing</subject><subject>Atomic structure</subject><subject>Diffusion</subject><subject>Electron microscopy</subject><subject>Grain boundaries</subject><subject>Grain growth</subject><subject>Heterogeneous interface</subject><subject>Interface stability</subject><subject>Metallic multilayers</subject><subject>Multilayers</subject><subject>Scale effect</subject><subject>Thermal stability</subject><subject>Thickness</subject><subject>Transmission electron microscopy</subject><issn>0921-5093</issn><issn>1873-4936</issn><fulltext>true</fulltext><rsrctype>article</rsrctype><creationdate>2017</creationdate><recordtype>article</recordtype><recordid>eNp9kE1LxDAQhoMouK7-AU8Fz-3OpG3agJdl8QsXvOg5pOlkt6Ufa9IK--9tqWcPwxzmfWaGh7F7hAgBxaaOWk864oBZBBhBkl-wFeZZHCYyFpdsBZJjmIKMr9mN9zUAYALpir3vqTsMx8Ab3VBA1pIZgr4LhiPN5VrdBH7QRdVUwznobdDprl_Cu3GzPQTt2AxVo8_k_C27srrxdPfX1-zr-elz9xruP17edtt9aGKeD6HAFIQwKWFisyKRQmZQcFNKHktKUeaIRZIYyLNcoCabl6JI42kqIJbWinjNHpa9J9d_j-QHVfej66aTCmXCM55zjlOKLynjeu8dWXVyVavdWSGoWZqq1SxNzdIUoJqkTdDjAtH0_09FTnlTUWeorNxkRpV99R_-C7ntc64</recordid><startdate>20170216</startdate><enddate>20170216</enddate><creator>Ma, Y.J.</creator><creator>Wei, M.Z.</creator><creator>Sun, C.</creator><creator>Cao, Z.H.</creator><creator>Meng, X.K.</creator><general>Elsevier B.V</general><general>Elsevier BV</general><scope>AAYXX</scope><scope>CITATION</scope><scope>7SR</scope><scope>8BQ</scope><scope>8FD</scope><scope>JG9</scope></search><sort><creationdate>20170216</creationdate><title>Length scale effect on the thermal stability of nanoscale Cu/Ag multilayers</title><author>Ma, Y.J. ; Wei, M.Z. ; Sun, C. ; Cao, Z.H. ; Meng, X.K.</author></sort><facets><frbrtype>5</frbrtype><frbrgroupid>cdi_FETCH-LOGICAL-c328t-615066c5e14f7b496970b2cd9239e519811b44c087861aef8d6b539236039ff63</frbrgroupid><rsrctype>articles</rsrctype><prefilter>articles</prefilter><language>eng</language><creationdate>2017</creationdate><topic>Annealing</topic><topic>Atomic structure</topic><topic>Diffusion</topic><topic>Electron microscopy</topic><topic>Grain boundaries</topic><topic>Grain growth</topic><topic>Heterogeneous interface</topic><topic>Interface stability</topic><topic>Metallic multilayers</topic><topic>Multilayers</topic><topic>Scale effect</topic><topic>Thermal stability</topic><topic>Thickness</topic><topic>Transmission electron microscopy</topic><toplevel>peer_reviewed</toplevel><toplevel>online_resources</toplevel><creatorcontrib>Ma, Y.J.</creatorcontrib><creatorcontrib>Wei, M.Z.</creatorcontrib><creatorcontrib>Sun, C.</creatorcontrib><creatorcontrib>Cao, Z.H.</creatorcontrib><creatorcontrib>Meng, X.K.</creatorcontrib><collection>CrossRef</collection><collection>Engineered Materials Abstracts</collection><collection>METADEX</collection><collection>Technology Research Database</collection><collection>Materials Research Database</collection><jtitle>Materials science & engineering. A, Structural materials : properties, microstructure and processing</jtitle></facets><delivery><delcategory>Remote Search Resource</delcategory><fulltext>fulltext</fulltext></delivery><addata><au>Ma, Y.J.</au><au>Wei, M.Z.</au><au>Sun, C.</au><au>Cao, Z.H.</au><au>Meng, X.K.</au><format>journal</format><genre>article</genre><ristype>JOUR</ristype><atitle>Length scale effect on the thermal stability of nanoscale Cu/Ag multilayers</atitle><jtitle>Materials science & engineering. A, Structural materials : properties, microstructure and processing</jtitle><date>2017-02-16</date><risdate>2017</risdate><volume>686</volume><spage>142</spage><epage>149</epage><pages>142-149</pages><issn>0921-5093</issn><eissn>1873-4936</eissn><abstract>The annealing induced grain growth (GG) and heterogeneous interface evolution of Cu/Ag multilayers with individual layer thickness (h) varying from 5 to 50nm were investigated by transmission electron microscopy (TEM). The results demonstrate that the thermal stability of Cu/Ag multilayers exhibits strong length scale dependence. For samples with h<20nm, the heterogeneous interfaces completely disappear when the annealing temperature exceeds 200°C. However, the temperature for stable layered structure can reach 300°C as the h≥20nm, where the interfaces remain remarkably intact. The existence of a large number of grain boundaries (GBs) decrease the stability of multilayers, while more heterogeneous interfaces contribute to resisting atomic diffusion, inhibiting GG. The equilibrium is achieved by a competitive process between GBs diffusion and heterogeneous interfaces resistance. Moreover, the formation of annealing twins in multilayer also significantly improve the microstructural stability.</abstract><cop>Lausanne</cop><pub>Elsevier B.V</pub><doi>10.1016/j.msea.2017.01.048</doi><tpages>8</tpages></addata></record> |
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| source | Elsevier ScienceDirect Journals |
| subjects | Annealing Atomic structure Diffusion Electron microscopy Grain boundaries Grain growth Heterogeneous interface Interface stability Metallic multilayers Multilayers Scale effect Thermal stability Thickness Transmission electron microscopy |
| title | Length scale effect on the thermal stability of nanoscale Cu/Ag multilayers |
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