Length scale effect on the thermal stability of nanoscale Cu/Ag multilayers

Length scale effect on the thermal stability of nanoscale Cu/Ag multilayers

The annealing induced grain growth (GG) and heterogeneous interface evolution of Cu/Ag multilayers with individual layer thickness (h) varying from 5 to 50nm were investigated by transmission electron microscopy (TEM). The results demonstrate that the thermal stability of Cu/Ag multilayers exhibits...

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Veröffentlicht in:Materials science & engineering. A, Structural materials : properties, microstructure and processing Structural materials : properties, microstructure and processing, 2017-02, Vol.686, p.142-149
Hauptverfasser: Ma, Y.J., Wei, M.Z., Sun, C., Cao, Z.H., Meng, X.K.
Format: Artikel
Sprache:eng
Schlagworte:
Annealing
Atomic structure
Diffusion
Electron microscopy
Grain boundaries
Grain growth
Heterogeneous interface
Interface stability
Metallic multilayers
Multilayers
Scale effect
Thermal stability
Thickness
Transmission electron microscopy
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Beschreibung
Zusammenfassung:The annealing induced grain growth (GG) and heterogeneous interface evolution of Cu/Ag multilayers with individual layer thickness (h) varying from 5 to 50nm were investigated by transmission electron microscopy (TEM). The results demonstrate that the thermal stability of Cu/Ag multilayers exhibits strong length scale dependence. For samples with h
ISSN:0921-5093
1873-4936
DOI:10.1016/j.msea.2017.01.048