Enhanced Thermal Stability in SiO2/Carbon Filler Derived from Rice Husk via Microwave Treatment for Electronic Packaging Application

Here we report the effect of microwave treatment on a silica–carbon (SiO2 /C) filler derived from rice husk and the function of the microwave‐treated filler in an epoxy matrix for electronic packaging applications. Thermogravimetric analysis revealed improved thermal stability of the SiO2 /C filler...

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Veröffentlicht in:	Journal of the Chinese Chemical Society (Taipei) 2017-09, Vol.64 (9), p.1035-1040
Hauptverfasser:	Hsieh, Ya‐Yu, Huang, Chin‐Zen, Tsai, Yun‐Chih, Lin, Hong‐Ping, Hsu, Chun‐Han, Loganathan, Aswaghosh
Format:	Artikel
Sprache:	eng
Schlagworte:	Glass transition temperature Green chemistry Material science Microwave heating Nanomaterials Polymer matrix composites Silicon dioxide Stability analysis Storage modulus Thermal conductivity Thermal stability Thermogravimetric analysis
Online-Zugang:	Volltext
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