Enhanced Thermal Stability in SiO2/Carbon Filler Derived from Rice Husk via Microwave Treatment for Electronic Packaging Application

Here we report the effect of microwave treatment on a silica–carbon (SiO2 /C) filler derived from rice husk and the function of the microwave‐treated filler in an epoxy matrix for electronic packaging applications. Thermogravimetric analysis revealed improved thermal stability of the SiO2 /C filler upon microwave treatment. X‐ray diffraction analysis indicated partial SiC formation after the microwave treatment. For packaging applications, compared to that of the pure epoxy polymer, the thermal conductivity of the epoxy–SiO2 /C composite was improved by 178% at 40 wt % content of the microwave‐treated SiO2 /C filler. Furthermore, an improvement of 149% in storage modulus and 17.6°C in glass transition temperature of the epoxy–SiO2 /C composites was realized. The improvement in thermal stability of SiO2 /C filler could be achieved via a simple microwave treatment, which in turn enhanced the thermal stability, thermal conduction, and thermomechanical strength of the electronic packaging materials. Improvement in thermal stability of SiO2/C filler could be achieved via a microwave treatment, which in turn enhanced the thermal stability, thermal conduction, and thermomechanical strength of the electronic packaging materials.