Influence of bismuth on the solidification of Sn-0.7Cu-0.05Ni-xBi/Cu joints

The improvement of solder joint mechanical performance due to bismuth additions is of ongoing interest. This paper investigates the influence of 0–14 wt% Bi on microstructure formation in Sn-0.7 wt%Cu-0.05 wt%Ni-xBi solder balls on Cu substrates. It is shown that Bi additions reduce the Ni content of (Cu,Ni)6Sn5, increase the size of primary (Cu,Ni)6Sn5 rods and reduce the thickness of the Cu6Sn5 reaction layer, although these effects are subtle until the Bi content reaches ∼5 wt%Bi and Bi additions of ≤5 wt% did not significantly affect the positive effects of Ni. Higher Bi additions (≥8 wt% Bi) caused a transition of the tin growth texture from columnar grains with a fibre texture towards a single grain with subgrains. Bi additions increased the non-equilibrium freezing range and caused a nonequilibrium ternary eutectic reaction in joints containing ≥2 wt% Bi. Bi contents less than 2 wt% are required to prevent (Bi) phase formation during solidification. [Display omitted] •Sn-0.7Cu-0.05Ni/Cu BGA joints have a columnar tin fibre texture.•Bi levels ≥8 wt% cause a transition from columnar to single grain tin textures.•0–14%Bi gradually alters the Ni content, thickness and grain size of the Cu6Sn5 layer.•Less than 2 wt% Bi are required to prevent (Bi) phase formation during solidification.