Thin large area vertical Schottky barrier diamond diodes with low on-resistance made by ion-beam assisted lift-off technique

We designed and made 15μm large area vertical Schottky barrier diamond diodes with resulting substrate thickness of about 1μm. The ion-beam assisted lift-off technique was successfully used to separate 5×5mm2 active two-layered structure from ballast HPHT diamond substrate. The fabricated diodes had...

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Veröffentlicht in:Diamond and related materials 2017-05, Vol.75, p.78-84
Hauptverfasser: Bormashov, V.S., Terentiev, S.A., Buga, S.G., Tarelkin, S.A., Volkov, A.P., Teteruk, D.V., Kornilov, N.V., Kuznetsov, M.S., Blank, V.D.
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container_start_page 78
container_title Diamond and related materials
container_volume 75
creator Bormashov, V.S.
Terentiev, S.A.
Buga, S.G.
Tarelkin, S.A.
Volkov, A.P.
Teteruk, D.V.
Kornilov, N.V.
Kuznetsov, M.S.
Blank, V.D.
description We designed and made 15μm large area vertical Schottky barrier diamond diodes with resulting substrate thickness of about 1μm. The ion-beam assisted lift-off technique was successfully used to separate 5×5mm2 active two-layered structure from ballast HPHT diamond substrate. The fabricated diodes had
doi_str_mv 10.1016/j.diamond.2017.02.006
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The ion-beam assisted lift-off technique was successfully used to separate 5×5mm2 active two-layered structure from ballast HPHT diamond substrate. The fabricated diodes had &lt;6mΩ∗cm2 (0.03Ω) on-resistance at room temperature and 3mΩ∗cm2 (0.015Ω) at 200°C fixed temperature of the diode case. A removal of large ballast substrate resistance results in a significant drop of on-state voltage, power losses and, therefore, increasing of diode efficiency. An additional technology step of sacrificial layer formation by ion implantation did not cause a considerable degradation of diode reverse characteristics. As a result, the room-temperature Baliga's figure of merit of the fabricated thin diodes is more than ten times higher comparing to earlier made thick diodes with a drift layer of the same thickness and boron content. 20A maximum forward DC current and &lt;2V voltage drop were measured at fixed case temperatures in the range from 0°C to 200°C using an active heat sink. [Display omitted] •We fabricated 15μm thick large area Schottky barrier diamond diodes by ion-beam assisted lift-off technique.•Packaged diodes provided the lowest reported on-resistance of 0.03Ω at RT and 0.015Ω at 200°C.•Reducing losses due to separation of thin structure from substrate results in increase of forward current.•20A forward DC current at &lt;2V voltage drop were measured in the range from 0°C to 200°C.</description><identifier>ISSN: 0925-9635</identifier><identifier>EISSN: 1879-0062</identifier><identifier>DOI: 10.1016/j.diamond.2017.02.006</identifier><language>eng</language><publisher>Amsterdam: Elsevier B.V</publisher><subject>Ballast ; Boron ; Diamonds ; Diodes ; Direct current ; Electric potential ; Electric resistance ; Electrical properties ; Figure of merit ; Forward current ; Ion beam implantation ; Ion beams ; Ion implantation ; Lift-off procedure ; Liftoff ; Power efficiency ; Schottky barrier diode ; Schottky diodes ; Synthetic diamond ; Thickness ; Voltage drop</subject><ispartof>Diamond and related materials, 2017-05, Vol.75, p.78-84</ispartof><rights>2017 Elsevier B.V.</rights><rights>Copyright Elsevier BV May 2017</rights><lds50>peer_reviewed</lds50><oa>free_for_read</oa><woscitedreferencessubscribed>false</woscitedreferencessubscribed><citedby>FETCH-LOGICAL-c384t-ec1e13e52371658f9cbca2f305d2517f1a1cad2da3c68ddf27dbecc4345256b03</citedby><cites>FETCH-LOGICAL-c384t-ec1e13e52371658f9cbca2f305d2517f1a1cad2da3c68ddf27dbecc4345256b03</cites></display><links><openurl>$$Topenurl_article</openurl><openurlfulltext>$$Topenurlfull_article</openurlfulltext><thumbnail>$$Tsyndetics_thumb_exl</thumbnail><linktohtml>$$Uhttps://www.sciencedirect.com/science/article/pii/S0925963516306422$$EHTML$$P50$$Gelsevier$$H</linktohtml><link.rule.ids>314,776,780,3537,27901,27902,65306</link.rule.ids></links><search><creatorcontrib>Bormashov, V.S.</creatorcontrib><creatorcontrib>Terentiev, S.A.</creatorcontrib><creatorcontrib>Buga, S.G.</creatorcontrib><creatorcontrib>Tarelkin, S.A.</creatorcontrib><creatorcontrib>Volkov, A.P.</creatorcontrib><creatorcontrib>Teteruk, D.V.</creatorcontrib><creatorcontrib>Kornilov, N.V.</creatorcontrib><creatorcontrib>Kuznetsov, M.S.</creatorcontrib><creatorcontrib>Blank, V.D.</creatorcontrib><title>Thin large area vertical Schottky barrier diamond diodes with low on-resistance made by ion-beam assisted lift-off technique</title><title>Diamond and related materials</title><description>We designed and made 15μm large area vertical Schottky barrier diamond diodes with resulting substrate thickness of about 1μm. The ion-beam assisted lift-off technique was successfully used to separate 5×5mm2 active two-layered structure from ballast HPHT diamond substrate. The fabricated diodes had &lt;6mΩ∗cm2 (0.03Ω) on-resistance at room temperature and 3mΩ∗cm2 (0.015Ω) at 200°C fixed temperature of the diode case. A removal of large ballast substrate resistance results in a significant drop of on-state voltage, power losses and, therefore, increasing of diode efficiency. An additional technology step of sacrificial layer formation by ion implantation did not cause a considerable degradation of diode reverse characteristics. As a result, the room-temperature Baliga's figure of merit of the fabricated thin diodes is more than ten times higher comparing to earlier made thick diodes with a drift layer of the same thickness and boron content. 20A maximum forward DC current and &lt;2V voltage drop were measured at fixed case temperatures in the range from 0°C to 200°C using an active heat sink. [Display omitted] •We fabricated 15μm thick large area Schottky barrier diamond diodes by ion-beam assisted lift-off technique.•Packaged diodes provided the lowest reported on-resistance of 0.03Ω at RT and 0.015Ω at 200°C.•Reducing losses due to separation of thin structure from substrate results in increase of forward current.•20A forward DC current at &lt;2V voltage drop were measured in the range from 0°C to 200°C.</description><subject>Ballast</subject><subject>Boron</subject><subject>Diamonds</subject><subject>Diodes</subject><subject>Direct current</subject><subject>Electric potential</subject><subject>Electric resistance</subject><subject>Electrical properties</subject><subject>Figure of merit</subject><subject>Forward current</subject><subject>Ion beam implantation</subject><subject>Ion beams</subject><subject>Ion implantation</subject><subject>Lift-off procedure</subject><subject>Liftoff</subject><subject>Power efficiency</subject><subject>Schottky barrier diode</subject><subject>Schottky diodes</subject><subject>Synthetic diamond</subject><subject>Thickness</subject><subject>Voltage drop</subject><issn>0925-9635</issn><issn>1879-0062</issn><fulltext>true</fulltext><rsrctype>article</rsrctype><creationdate>2017</creationdate><recordtype>article</recordtype><recordid>eNqFkEtLAzEUhYMoWKs_QQi4njGPZqazEim-oODCug6Z5MZmnE5qkrYU_PGmtHtX53If53A_hG4pKSmh1X1XGqdWfjAlI7QuCSsJqc7QiE7rpsglO0cj0jBRNBUXl-gqxo4QypoJHaHfxdINuFfhC7AKoPAWQnJa9fhDL31K33vcqhAcBHwKyeoNRLxzaYl7v8N-KAJEF5MaNOCVMoDbPXa53YJaYRUPMzC4dzYV3lqcQC8H97OBa3RhVR_h5qRj9Pn8tJi9FvP3l7fZ47zQfDpJBWgKlINgvKaVmNpGt1oxy4kwTNDaUkW1MsworqupMZbVpgWtJ3wimKhawsfo7ui7Dj7HxiQ7vwlDjpS04Yxyxlmdt8RxSwcfYwAr18GtVNhLSuQBtOzkiYE8gJaEyUw33z0c7yC_sM2kZNQOMgvjAugkjXf_OPwBBWGLtQ</recordid><startdate>201705</startdate><enddate>201705</enddate><creator>Bormashov, V.S.</creator><creator>Terentiev, S.A.</creator><creator>Buga, S.G.</creator><creator>Tarelkin, S.A.</creator><creator>Volkov, A.P.</creator><creator>Teteruk, D.V.</creator><creator>Kornilov, N.V.</creator><creator>Kuznetsov, M.S.</creator><creator>Blank, V.D.</creator><general>Elsevier B.V</general><general>Elsevier BV</general><scope>AAYXX</scope><scope>CITATION</scope><scope>7SR</scope><scope>8BQ</scope><scope>8FD</scope><scope>JG9</scope></search><sort><creationdate>201705</creationdate><title>Thin large area vertical Schottky barrier diamond diodes with low on-resistance made by ion-beam assisted lift-off technique</title><author>Bormashov, V.S. ; Terentiev, S.A. ; Buga, S.G. ; Tarelkin, S.A. ; Volkov, A.P. ; Teteruk, D.V. ; Kornilov, N.V. ; Kuznetsov, M.S. ; Blank, V.D.</author></sort><facets><frbrtype>5</frbrtype><frbrgroupid>cdi_FETCH-LOGICAL-c384t-ec1e13e52371658f9cbca2f305d2517f1a1cad2da3c68ddf27dbecc4345256b03</frbrgroupid><rsrctype>articles</rsrctype><prefilter>articles</prefilter><language>eng</language><creationdate>2017</creationdate><topic>Ballast</topic><topic>Boron</topic><topic>Diamonds</topic><topic>Diodes</topic><topic>Direct current</topic><topic>Electric potential</topic><topic>Electric resistance</topic><topic>Electrical properties</topic><topic>Figure of merit</topic><topic>Forward current</topic><topic>Ion beam implantation</topic><topic>Ion beams</topic><topic>Ion implantation</topic><topic>Lift-off procedure</topic><topic>Liftoff</topic><topic>Power efficiency</topic><topic>Schottky barrier diode</topic><topic>Schottky diodes</topic><topic>Synthetic diamond</topic><topic>Thickness</topic><topic>Voltage drop</topic><toplevel>peer_reviewed</toplevel><toplevel>online_resources</toplevel><creatorcontrib>Bormashov, V.S.</creatorcontrib><creatorcontrib>Terentiev, S.A.</creatorcontrib><creatorcontrib>Buga, S.G.</creatorcontrib><creatorcontrib>Tarelkin, S.A.</creatorcontrib><creatorcontrib>Volkov, A.P.</creatorcontrib><creatorcontrib>Teteruk, D.V.</creatorcontrib><creatorcontrib>Kornilov, N.V.</creatorcontrib><creatorcontrib>Kuznetsov, M.S.</creatorcontrib><creatorcontrib>Blank, V.D.</creatorcontrib><collection>CrossRef</collection><collection>Engineered Materials Abstracts</collection><collection>METADEX</collection><collection>Technology Research Database</collection><collection>Materials Research Database</collection><jtitle>Diamond and related materials</jtitle></facets><delivery><delcategory>Remote Search Resource</delcategory><fulltext>fulltext</fulltext></delivery><addata><au>Bormashov, V.S.</au><au>Terentiev, S.A.</au><au>Buga, S.G.</au><au>Tarelkin, S.A.</au><au>Volkov, A.P.</au><au>Teteruk, D.V.</au><au>Kornilov, N.V.</au><au>Kuznetsov, M.S.</au><au>Blank, V.D.</au><format>journal</format><genre>article</genre><ristype>JOUR</ristype><atitle>Thin large area vertical Schottky barrier diamond diodes with low on-resistance made by ion-beam assisted lift-off technique</atitle><jtitle>Diamond and related materials</jtitle><date>2017-05</date><risdate>2017</risdate><volume>75</volume><spage>78</spage><epage>84</epage><pages>78-84</pages><issn>0925-9635</issn><eissn>1879-0062</eissn><abstract>We designed and made 15μm large area vertical Schottky barrier diamond diodes with resulting substrate thickness of about 1μm. The ion-beam assisted lift-off technique was successfully used to separate 5×5mm2 active two-layered structure from ballast HPHT diamond substrate. The fabricated diodes had &lt;6mΩ∗cm2 (0.03Ω) on-resistance at room temperature and 3mΩ∗cm2 (0.015Ω) at 200°C fixed temperature of the diode case. A removal of large ballast substrate resistance results in a significant drop of on-state voltage, power losses and, therefore, increasing of diode efficiency. An additional technology step of sacrificial layer formation by ion implantation did not cause a considerable degradation of diode reverse characteristics. As a result, the room-temperature Baliga's figure of merit of the fabricated thin diodes is more than ten times higher comparing to earlier made thick diodes with a drift layer of the same thickness and boron content. 20A maximum forward DC current and &lt;2V voltage drop were measured at fixed case temperatures in the range from 0°C to 200°C using an active heat sink. [Display omitted] •We fabricated 15μm thick large area Schottky barrier diamond diodes by ion-beam assisted lift-off technique.•Packaged diodes provided the lowest reported on-resistance of 0.03Ω at RT and 0.015Ω at 200°C.•Reducing losses due to separation of thin structure from substrate results in increase of forward current.•20A forward DC current at &lt;2V voltage drop were measured in the range from 0°C to 200°C.</abstract><cop>Amsterdam</cop><pub>Elsevier B.V</pub><doi>10.1016/j.diamond.2017.02.006</doi><tpages>7</tpages><oa>free_for_read</oa></addata></record>
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subjects Ballast
Boron
Diamonds
Diodes
Direct current
Electric potential
Electric resistance
Electrical properties
Figure of merit
Forward current
Ion beam implantation
Ion beams
Ion implantation
Lift-off procedure
Liftoff
Power efficiency
Schottky barrier diode
Schottky diodes
Synthetic diamond
Thickness
Voltage drop
title Thin large area vertical Schottky barrier diamond diodes with low on-resistance made by ion-beam assisted lift-off technique
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