P‐40: 12. 3 inch Automotive Free‐form Curved Cluster
BOE has made 12.3 inch automotive free‐form curved cluster. GIA layout, separated driving and curve radius 700mm were designed to realize free form curved cluster. Besides, bottom IC placement were applied to get narrow border, separated zigzag pixel arrangement were applied to get free form, and gl...
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Veröffentlicht in: | SID International Symposium Digest of technical papers 2017-05, Vol.48 (1), p.1387-1390 |
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Format: | Artikel |
Sprache: | eng |
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Zusammenfassung: | BOE has made 12.3 inch automotive free‐form curved cluster. GIA layout, separated driving and curve radius 700mm were designed to realize free form curved cluster. Besides, bottom IC placement were applied to get narrow border, separated zigzag pixel arrangement were applied to get free form, and glass slimming were applied to get curved. Stress simulation was done to alleviate L0 light leak for curved module. Thermal simulation and optical simulation were also done to improve the performance. In transition phase, some designs will be optimized to avoid reliability risk. |
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ISSN: | 0097-966X 2168-0159 |
DOI: | 10.1002/sdtp.11907 |