P‐67: An Analytical Method of Small‐Sized Module Waving Based on the Finite‐Element Simulation

The film waving is a serious issue during design and experiment. Generally we have to change the design and do reliability experiments repeatedly. Based on finite element thermo‐mechanical coupling simulation, this paper presents a method to find the influencing factors and quantify the criteria of...

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Veröffentlicht in:SID International Symposium Digest of technical papers 2017-05, Vol.48 (1), p.1494-1497
Hauptverfasser: Zhang, Bingchuan, Zheng, Yingbo, Lin, Yanfeng, Zhou, Gege, Lv, Chengling
Format: Artikel
Sprache:eng
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Zusammenfassung:The film waving is a serious issue during design and experiment. Generally we have to change the design and do reliability experiments repeatedly. Based on finite element thermo‐mechanical coupling simulation, this paper presents a method to find the influencing factors and quantify the criteria of waving.
ISSN:0097-966X
2168-0159
DOI:10.1002/sdtp.11932