P‐67: An Analytical Method of Small‐Sized Module Waving Based on the Finite‐Element Simulation
The film waving is a serious issue during design and experiment. Generally we have to change the design and do reliability experiments repeatedly. Based on finite element thermo‐mechanical coupling simulation, this paper presents a method to find the influencing factors and quantify the criteria of...
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Veröffentlicht in: | SID International Symposium Digest of technical papers 2017-05, Vol.48 (1), p.1494-1497 |
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Hauptverfasser: | , , , , |
Format: | Artikel |
Sprache: | eng |
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Online-Zugang: | Volltext |
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Zusammenfassung: | The film waving is a serious issue during design and experiment. Generally we have to change the design and do reliability experiments repeatedly. Based on finite element thermo‐mechanical coupling simulation, this paper presents a method to find the influencing factors and quantify the criteria of waving. |
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ISSN: | 0097-966X 2168-0159 |
DOI: | 10.1002/sdtp.11932 |