A metalized-hole PCB as a strain gauge

A method for using metalized holes in thin sheet composite materials of printed circuit boards for measuring thermomechanical stresses in the transverse direction relative to the stiffening sides is described. It was found that each 1% hole metalization strain corresponds to a 2% resistance change i...

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Veröffentlicht in:	Instruments and experimental techniques (New York) 2016-11, Vol.59 (6), p.879-881
1. Verfasser:	Medvedev, A. M.
Format:	Artikel
Sprache:	eng
Schlagworte:	Circuit boards Electrical Engineering Laboratory Techniques Measurement Science and Instrumentation Physical Chemistry Physics Physics and Astronomy Printed circuits Strain gauges
Online-Zugang:	Volltext
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Beschreibung
Zusammenfassung:	A method for using metalized holes in thin sheet composite materials of printed circuit boards for measuring thermomechanical stresses in the transverse direction relative to the stiffening sides is described. It was found that each 1% hole metalization strain corresponds to a 2% resistance change in this metallization. The results of studies are presented as applied to the materials of the bases of printed circuit boards, which are widely used in electronics, in particular, in avionics.
ISSN:	0020-4412 1608-3180
DOI:	10.1134/S0020441216060051