Research on Low Temperature Anodic Bonding Based on Interface Pretreatment of Dielectric Barrier Discharge Plasma

A simple composite bonding that combines dielectric barrier discharge (DBD) plasma activation with anodic bonding has been developed to achieve strong silicon/glass bonding at low temperature. The realization of low temperature bonding is attributed to enhance the hydrophilicity and smooth of silico...

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Veröffentlicht in:	Key engineering materials 2015-05, Vol.645-646, p.356-361
Hauptverfasser:	Pan, Ming Qiang, Sun, Lin Ning, Wang, Yang Jun, Liu, Ji Zhu, Liu, Hui Cong, Chen, Li Guo, Chen, Tao
Format:	Artikel
Sprache:	eng
Online-Zugang:	Volltext
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