Improved Switching Voltage Variation of Cu Atom Switch for Nonvolatile Programmable Logic
Switching voltage variation of a Cu atom switch (AS) is improved to δ = 9.5 % by adjusting the buffer oxidation state and electrode surface roughness. The complementary AS (CAS) connects two Cu lines at each edge and is composed of a dual-layered electrolyte of oxidized Ti buffer metal/polymer solid...
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Veröffentlicht in: | IEEE transactions on electron devices 2014-11, Vol.61 (11), p.3827-3832 |
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Format: | Artikel |
Sprache: | eng |
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Zusammenfassung: | Switching voltage variation of a Cu atom switch (AS) is improved to δ = 9.5 % by adjusting the buffer oxidation state and electrode surface roughness. The complementary AS (CAS) connects two Cu lines at each edge and is composed of a dual-layered electrolyte of oxidized Ti buffer metal/polymer solid electrolyte. A sufficiently oxidized Ti buffer layer prevents both Cu oxidation and Ti diffusion during the fabrication processes, reducing the OFF-state leakage current and making the ON/OFF current ratio high. A dry cleaning process reduces the Cu electrode surface roughness, tightening the set voltage distribution and enabling the use of a low programming voltage, 1.8 V. A large-scale crossbar switch block consisting of CASs has been operated by the improved switches. |
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ISSN: | 0018-9383 1557-9646 |
DOI: | 10.1109/TED.2014.2355830 |