Curing Behaviors of UV-Curable Temporary Adhesives for a 3D Multichip Package Process

Temporary bonding adhesives for a three-dimensional (3D) multichip package process have been synthesized. To enhance the thermal stability, the adhesives used a fluorinated silicon urethane acrylic binder and ultraviolet (UV) curing for crosslinked network structures. Focusing on different photoinit...

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Veröffentlicht in:	Journal of electronic materials 2014-11, Vol.43 (11), p.4246-4254
Hauptverfasser:	Lee, Seung-Woo, Lee, Tae-Hyung, Park, Ji-Won, Park, Cho-Hee, Kim, Hyun-Joong, Song, Jun-Yeob, Lee, Jae-Hak
Format:	Artikel
Sprache:	eng
Schlagworte:	Adhesives Bond strength Characterization and Evaluation of Materials Chemical synthesis Chemistry and Materials Science Condensed matter: structure, mechanical and thermal properties Electronics and Microelectronics Exact sciences and technology Instrumentation Materials Science Optical and Electronic Materials Physics Solid State Physics Thermal expansion thermomechanical effects and density Thermal properties of condensed matter Thermal properties of crystalline solids Three dimensional imaging
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Beschreibung
Zusammenfassung:	Temporary bonding adhesives for a three-dimensional (3D) multichip package process have been synthesized. To enhance the thermal stability, the adhesives used a fluorinated silicon urethane acrylic binder and ultraviolet (UV) curing for crosslinked network structures. Focusing on different photoinitiator contents and UV doses, the UV-curing behaviors and thermal stability were studied using Fourier-transform infrared spectroscopy attenuated total reflectance, gel fraction, swelling ratio, shrinkage, and thermogravimetric analyses.
ISSN:	0361-5235 1543-186X
DOI:	10.1007/s11664-014-3354-4